BE Semiconductor Industries N.V. (BESI) Earnings Call Transcripts

BE Semiconductor Industries N.V.'s Latest Earnings Call - June 18, 2026

During the June 18, 2026, earnings call for BE Semiconductor Industries N.V. (BESI), management focused on long-term strategic updates rather than Q2 numbers. They announced an increase in their target model from EUR 1.5 billion to EUR 1.9 billion, with expectations to reach EUR 1.7 billion to EUR 2.2 billion. This reflects a significant shift driven by AI infrastructure growth, with a notable impact on their hybrid bonding technology. Management highlighted that gross margins, traditionally in the mid-60s, are expected to improve, with Q2 guidance suggesting a move above 30% net margins. The company's strategic focus on AI and advanced packaging is expected to drive future growth.

Reported metrics

Guidance from management

Management raised their target model to EUR 1.7 billion to EUR 2.2 billion, driven by AI infrastructure growth. They expect gross margins to improve and net margins to exceed 30% in Q2.

What management said

It definitely is also for us a large opportunity, the tariff app, and we have started discussing with the with the team, which is setting up the tariff up in the United States. They have confirmed that this will not only be a front-end facility, but also packaging will be included. And so yes, out of that. That's a business opportunity. And as it's a [indiscernible] a, obviously, a very big one.

And every chip needs to be assembled one way or the other. So that is directly to confirm what Peter said. And the good thing is, again, with our applied relationship, we are engaged from the very beginning, same with [ Rapids ] in Japan. Same with new fabs being built in the U.S. So just to confirm that we are very much engaged in that is an understatement.

What analysts pressed on

Analysts expressed concerns about Besi's capacity to meet future demand and the steps needed for high-volume adoption of hybrid bonding in HBM. There were also questions about the competitive landscape and the potential impact of geopolitical factors on the business.

Main topics on the call

• AI Market Acceleration — The AI market has accelerated faster than expected, with Tech Insights anticipating EUR 1.4 trillion in semiconductor revenue this year, up from previous forecasts. This rapid growth is driving opportunities for Besi, pa...
• Hybrid Bonding Adoption — Hybrid bonding is becoming the predominant interconnect technology for AI logic devices. Management noted, 'hybrid bonding directly attacks all those bottlenecks' in multi-die AI architectures. The technology is gaining ...
• Market Share and Competitive Position — Besi is gaining market share with the right products and customers. Management stated, 'We have the right products, we have the right customers, and that has improved significantly in the last 12 months.'
• Photonics and Co-Packaged Optics — Photonics and co-packaged optics are emerging as significant growth areas, with Besi well-positioned to capitalize on these trends. The company highlighted the rapid transition from R&D to volume manufacturing in these s...

Read the full BE Semiconductor Industries N.V. transcript (June 18, 2026) → Summary generated from the call transcript; every figure above is stated by management on the record.

Earnings Call History

EarningsCalls.dev has 34 BE Semiconductor Industries N.V. earnings call transcripts on record, spanning February 20, 2020 to July 23, 2026. Based on this history, BE Semiconductor Industries N.V. reports quarterly. The most recent call on file is dated July 23, 2026. The full list is below — each row opens the complete, free-to-read transcript.

Ticker

BESI

Exchange

ENXTAM

Country

NL

Sector

Information Technology

Industry

Semiconductors and Semiconductor Equipment

Calls on record

34

First call

February 20, 2020

Most recent

July 23, 2026

Reporting cadence

quarterly