Kulicke and Soffa Industries, Inc. (KLIC) Earnings Call Transcript & Summary

Greetings, and welcome to Kulicke and Soffa's 2021 Investor Day and Conference Call. [Operator Instructions] As a reminder, this conference is being recorded. It is now my pleasure to introduce your host, Joseph Elgindy, Senior Director of Investor Relations and Strategic Initiatives for Kulicke and Soffa. Joseph, you may begin.

Welcome, everyone, to Kulicke and Soffa's 2021 Investor Day. Joining us on today's call are several members of the K&S leadership team who will provide a detailed review of our current and future business prospects as well as our long-term financial targets and framework. In addition to historical statements, today's remarks will contain statements relating to future events and our future results. These statements are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Our actual results and financial condition may differ materially from what is indicated in those forward-looking statements. Throughout today's presentation, we will reference our past, current and future baseline revenue assumptions, which represent a theoretical level of total company demand that is supported under a normalized industry growth environment. These baseline revenue assumptions are at the total company level and consider our access to new markets, our participation within several fundamental technology transitions and the replacement and incremental capacity dynamics of our core businesses. We believe this baseline perspective helps investors better understand the underlying dynamics and growth drivers of our businesses and served end markets. For a complete discussion of the risks associated with Kulicke and Soffa that could affect our future results and financial condition, please refer to our recent SEC filings, specifically the 10-K for the year ended October 3, 2020. We've recently celebrated our 70th anniversary and have a long history of innovation and leadership throughout our markets served. Based on current guidance for our fiscal fourth quarter, we have grown revenue at a 19% compound annual growth rate, while growing operating profit by a nearly 34% compound annual growth rate. Today, we have approximately 3,000 employees based out of 19 facilities in 13 countries. We collectively support nearly 2,000 customers and hold a very sizable market share within our long-established core markets. During today's meeting, we will discuss several fundamental improvements within these core markets and also provide an overview and outlook to the new higher-growth markets that we now have access to. You will also hear from several members of the K&S leadership team. This team has over a quarter century of cumulative industry experience and has led the organization through a significant transformation over the past 4 years. Fusen Chen, our President and Chief Executive Officer, will provide specifics to our organizational transformation and also to our underlying corporate strategy. Lester Wong, our Senior Vice President and Chief Financial Officer, will then walk through our financial framework and expectations. We are very happy to also showcase our key business segment heads: MK Han, as our General Manager of the Aftermarket Products and Services segment; and Chan Pin Chong, as our General Manager of the Capital Equipment segment. Both will provide many details into our respective positioning at the business and product levels. Additionally, Bob Chylak, our Chief Technology Officer, will discuss the significant and dramatic potential within the fast-growing mini and micro LED opportunity set. Finally, during the general semiconductor section of today's presentation, we are pleased to host a very special guest speaker who will provide an in-depth customer perspective into the growing value proposition of semiconductor assembly at the leading edge. Today's presentation is expected to run for approximately 2 hours, and we will hold a brief question-and-answer session to follow. I would now like to introduce our first speaker, President and CEO, Fusen Chen. Fusen has a long-established history of delivering value through the semiconductor equipment market and also directly to shareholders. Fusen joined K&S in 2016 and has been a catalyst for change, securing our dominant market positions today and materially improving our growth potential for tomorrow. Fusen has fundamentally enhanced Kulicke and Soffa's long-term potential through organizational change, aggressive and focused development and careful M&A, enhancing our competencies and access into several new and exciting high-growth market opportunities. With that said, I'm happy to introduce Fusen Chen, our President and Chief Executive Officer. Please go ahead, Fusen.

Thank you, Joe, and thank you all for joining us today. Despite recently celebrating our 70th anniversary, this is clearly a very unique time in the long history of K&S. Since joining the company 4 years ago, the entire organization has been very focused to deliver systemic ongoing improvement across all business functions, product lines and services. The key message from today's presentation is to highlight why we are now operating and plan to continue operating at a new higher level of performance going forward. Throughout today's discussion, we will provide many specific detail to how we can sustainably support a new higher level of growth and profitability going forward. We have refined our organization, enhanced our competency and have made investment to expand our offering and market presence. In addition to this comprehensive effort to drive consistent improvement, the core high-volume semiconductor market, which we have led for decades, rely increasingly more on our core competency in the solution. This core offering potentially serve the entire semiconductor market and are utilized to produce a diverse group of end applications, from lighting to smartphones and the 2 data centers. The diversity of consumer and commercial applications that rely on technology developed by K&S is significant. This novelty industry presence and position is supported by our diluted competency. K&S has strong history of technical strengths within motion control, autosonic, wedging system, software and metrology. Long-standing competency in supply chain management and operational excellence increase our ability to quickly respond to market dynamics, maximizing value at the shareholder level. More recently, we demonstrated our ability to identify, invest and commercialize new innovative solutions, which has allowed us to move into new exciting and high-growth markets. Our critical competency, combined with the diversity of our end market, is now allowing K&S to play a key role within several exciting technology-driven chains by automatically [ entering ] sizable end market. Within semiconductor, challenge of 2-dimensional node shrink are increasing the capital intensity across both high-volume and the leading edge applications. Next, electrification and autonomous trends are driving higher demand for semiconductor content, supporting infotainment, power distribution and the power storage needs. Finally, within the advanced display space, we are playing a key role to enable market adoption of both mini and micro LED technologies. These technology changes are increasing the size and the growth rate of our existing serviced market, while also providing meaningful and new opportunities, which are expanding our significance within the market we serve. Due to our customer engagement and relentless focus on technology change, we have prepared for this change over the past several years with focused and efficient R&D investment. We are very well prepared for this key transition and have a broad portfolio of competitive solutions that directly address these new industry challenges. Our current set of opportunities are now being realized due to a very experienced, empowered and accountable leadership team that has supported this transition. I'm pleased you will have the opportunity to hear from several of them during today's meeting. Ultimately, all of these factors have dramatically enhanced our ability to generate consistent cash flow. At this higher level of demand, fluctuation to broad industry demand trends are much less meaningful to our earnings and cash flow generation. Lester will provide many more detail on our new financial model shortly. Before we go into the detail of this presentation, we wanted to remind investors of our environmental, social and governance processes. Considering our global market leadership, we are in a position of strength to reduce our environmental impact, enhance employee culture and strengthen our business standards, while supporting the community where we operate. We have continued to expand our reporting metrics, while ensuring our organization is prepared to meet our future goals, and recently released our fifth annual sustainability report that provide many more details on this initiative. This initiative are some investments that enhance our corporate culture, creating a more aware, engaged and transparent organization, which strengthen our ability to drive operational excellence. When we examine how we create value, it starts with our employees and processes. Accountability and empowerment are essential to driving operational excellence and enhancing our ability to pursue multiple opportunities in parallel. Our market share is above 50% in our key served markets. This leadership, combined with our extensive customer network, allow us to keep a very [ close support ] on industry trends, which allow us to maximize access to new high-growth opportunities. Over the years, we have expanded our core semiconductor access into general semi, SMT, advanced display and automotive. K&S solutions has very broad industry exposure and are increasingly aligned with higher-growth end market, such as silicon photonics, leading-edge assembly, as well as prismatic and cylindrical battery assembly. This diversity provides the scale to distribute and support our product largely through internal sales channels. This channel not only enhance our efficiency and profitability but also provide a feedback loop, which help better understand our customers' challenges and enhance our future technology road map. Additionally, we have a very solid financial footing, which we have utilized within our opportunistic repurchase program and also through our consistent dividend. We have also utilized our strong financial position strategically to invest in key transitions that can benefit from our competency. The K&S global R&D team has repeatedly demonstrated our ability to quickly deliver new, innovative, high-quality solutions to meet specific industry needs. This strong R&D competency, combined with our ability to identify new market challenges, enhance our ability to sustainably grow our business. New market access and favorable market dynamics are allowing our opportunistic set to grow more rapidly than it has in the past as we execute on these new opportunities, likely in new business, which, again, will flow through this value-creation cycle. Looking ahead, there are several increasing valuable teams that support our achievement and growth. [ In all of this ], our industry is expanding more aggressively than it has before. This is being driven by higher semiconductor content in many end markets. The fine transition and the overall evolution are significant trends that support above-average growth over the near term. Next, we have demonstrated the ability to efficiently expand into adjacent market in the past, including battery assembly, SMT, LED, flip chip, thermo-compression as well as advanced displays. We have refined this development process, which enhance our pipeline and increase our success rate. Additionally, we have and will continue to target higher-growth adjacency to expand our served market. We have driven progress within the APS market and continue to seek out additional opportunity. MK will provide some additional information shortly. Assembly complexity is a major theme that is increasing our value operation in our core high-volume semiconductor market and also providing new access to the leading edge. This is supported by a significant paradigm shift within the broad semiconductor value chain. Finally, we are a key participant in the advanced display market due to our first-mover advantage, which has created a new competency set that we will continue to build on. We are rapidly developing our next-generation system and have several engaged customers. Bob Chylak will provide more information on this transition. Shortly after joining K&S, I've reorganized the company to drive a more accountable, efficient and empowered organization. Initially, this was focused in growing the APS segmentation and maximizing the efficiency of the global R&D chain. We set new growth and market share target within APS, which we are executing on, and have also dramatically increased the efficiency and the bandwidth of our R&D team. In the years that followed, we expand our served market access by gaining shares and also supporting above-average growth in specific market areas, including LED lighting and the heavy wedge, and began to benefit from increasing capital intensity within our core market. Finally, we have moved into new exciting market, including display, battery assembly and SMT, which provide both diversification and higher-growth opportunities. Our TAM has expanded by 250% over the past 7 years. Our strong employment and accountable organization structures and the culture has increased our bandwidth and efficiency, allowing us to rapidly address new market needs while expanding shares within markets served. Prudent acquisitions have increased our competency and provide immediate access to new and fast-growing market, while target R&D investment has extended our product portfolio. Looking ahead, we anticipate this SAM will increase further to approximately $5.5 billion by FY '24. This new market access provides diversification, higher growth and the incremental adjacent opportunity. Today, we are critically involved in several fundamental and significant technology transition across semiconductor, automotive and the display market. We have worked aggressively, helped strengthen our competency and expanded our product portfolio to support this specific trend. As this transition become more meaningful through fiscal '22, we are also enjoying a period of dramatic industry expansion. Here, our expansion is being driven by a dramatic increase in semiconductor demand across our end markets. 5G is a significant end market driver, which goes beyond smartphone and infrastructures, but also to new devices and applications. Additionally, 5G is supporting the new data era and also new higher bandwidth network requirement. Collectively, this fundamental technology transition, combined with the industry expansion period, is allowing us to operate at a new level of profitability, which we expect to be sustainable over the coming years. Looking ahead to fiscal 2024, we believe our targets are rational and realistic. However, we anticipate there could be upside to our forecasts and expectations based on the timing and the growth of this trend. I would now like to turn the discussion back to Joe Elgindy. Joe?

Thank you, Fusen. Our next presenter joined Kulicke and Soffa in 2011 and has nearly 30 years of experience leading a variety of functions, supporting both private and public organizations, largely within the software, Internet and technology markets. At K&S, Lester has been intimately involved in the development and execution of strategic initiatives at the product and corporate level. He has been critically involved in organizational change, our acquisition strategy and capital allocation initiatives. He has led the global finance, IT and facilities organizations at K&S since 2017. It's now my pleasure to introduce Lester Wong, Senior Vice President and Chief Financial Officer. Please go ahead, Lester.

Thank you, Joe, and thank you all for joining today. As Fusen mentioned, our entire organization has worked extensively to expand our market opportunities. This focus, combined with technology trends in our favor, provides new layers of structural growth, enabling better visibility and positioning us to outperform over the long term. Secondly, we have a track record of providing realistic and rational goals that are aligned with long-term market dynamics. I'll provide some details to our future financial model and framework shortly. Considering some of our higher-potential drivers, such as assembly complexity and advanced display, we see upside in the out years. Next, we have taken a very long-term view when allocating capital. We continue to have very strong balance sheet and have multiple paths to enhance returns at the shareholder level beyond the scope of our financial framework. Finally, it is very important to understand that our business is extremely more profitable at the $1.5 billion level. We have strategically enabled scale across our business from an OpEx standpoint. This inherent leverage increases profitability, but also increases our ability to generate much more consistent earnings going forward. Looking out over the coming years, we anticipate our baseline revenue to grow by $600 million by fiscal year 2024. And over the next few years, we're anticipating reaching $1.5 billion due to a period of broad industry expansion, combined with business execution, through fiscal 2023. We've introduced the concept of baseline revenue over the past few years to better help investors normalize our revenue. This baseline concept references historical trends and our underlying market dynamics, which help to understand the fundamental level of demand, regardless of broader industry conditions. Looking ahead, this additional incremental baseline growth stems from 12 specific opportunities, which we will outline in much more detail throughout today's discussion. To add more color, we have also categorized this growth based on 3 key strategies, which are evenly split. These stem from normal levels of semiconductor growth; above-average growth in markets, such as advanced packaging and automotive; and share gains within advanced logic market and also within our electronic assembly business. Looking back at our last Analyst Day, we set some aggressive targets based on our understanding of the market. At the time, they seem aspirational but have actually stemmed from our bottoms-up long-term planning process, which is conducted annually. While the year isn't over yet, we anticipate dramatically exceeding the stretch target of $1.2 billion. We expect to surpass our past revenue target by 25% and our non-GAAP EPS target by approximately 40% this year. At this point, fundamental technology transitions are progressing nicely and provide a higher level of long-term visibility throughout our businesses. Over the past years, our baseline revenue grew as the industry expanded, assembly started to become more complex, and we now have new access into the advanced display market. We have introduced a concept of baseline revenue, which helps to illustrate our annual revenue on a normalized basis. The variable we normalize to is semiconductor unit growth, which has averaged about 6.5% over the past decade. These new markets and core market growth opportunities within high-volume semi have allowed us to grow our baseline revenue from $675 million to $900 million over the past 3 years. Historically, industry dynamics have had a material impact on demand levels for our products. While semiconductor growth has averaged a 6.5% CAGR rate over the long term, there are periods of above-average and below-average growth. Our baseline model is calibrated to the historical average growth of 6.5%. We have recently exited an extended period of not only below-average growth but net negative growth. Fiscal 2019 and 2020 were very unique periods, with semiconductor unit growth significantly below average. This was related to the industry downturn, followed by a global pandemic, which impacted broad macro trends. Looking ahead, we are now experiencing fundamental technology transition, such as assembly complexity and above-average industry growth, due to new end markets like 5G, AI and the broader data era. These trends are allowing us to operate at a new higher level of performance in the near term and a higher sustainable level going forward. At the same time, we are very focused to execute and aggressively expand our offerings, which are providing meaningful share gain and new market opportunities. Throughout today's presentations, we will closely examine the individual opportunity sets across our end markets that bridge this baseline acceleration. Again, there are a set of 12 specific opportunities across these 4 major end market categories. Within general semi and memory, we see opportunities for market share gains, industry expansion and above-average growth. Within aftermarket products and services, the growing installed base expands our servable market, and we continue to execute our tactical strategy to provide additional value-add services. In the LED market, we anticipate market growth in the traditional lighting market to continue and much more significant growth within the broad advanced display evolution. Bob Chylak, our CTO, will provide specific details to why we're winning in this high-growth market. Finally, in automotive and industrial, we're expanding our offering to support new fast-growing markets. At the same time, the transition to electric vehicles and, ultimately, fully autonomous vehicles provide a long-term and interesting market opportunity. With the expanding baseline, our ability to generate and sustain a high level of earnings has significantly improved. As we execute to grow our baseline at a higher growth rate going forward, we continue to seek out new opportunities for margin expansion. We anticipate our gross margin to expand by approximately 500 basis points due to the growth in higher-margin business and aggressive focus on cost reduction, and also due to the new value proposition that has impacted the broad assembly market. By fiscal 2024, we anticipate our normalized non-GAAP earnings per share to sustain above $6. By this time, we see the potential for additional upside in our higher-growth markets, specifically, but not limited to, advanced packaging trends and also the global adoption of mini and micro LED. Assumptions in this model assumes semiconductor unit growth at, at least 6.5% in fiscal 2024. We are holding our tax rate and share count consistent at 18% and 63.5 million through this period. In addition to this positive financial framework, we will also continue to take a prudent, balanced and long-term view on our capital allocation strategy. A few key principles have guided our capital allocation strategy over the past several years. These include a very thoughtful and careful approach to internal and external investments. Here, we have worked to increase the success of internal projects by increasing long-term development engagement with our customers and other key industry partners. While many products can be accretive, we are very selective with new internal investments in an effort to align our business with higher-growth vectors. As we expand our competencies, it opens our access to a broader set of fast-growing and interesting opportunities. These provide a path to both organic and inorganic growth in the future to enhance earnings and deliver value to our shareholders. Next, we also want to maintain flexibility within our balance sheet to quickly invest in new organic and inorganic opportunities as they become available. Finally, our dividend and repurchase program allow us to provide both consistent and also opportunistic returns to shareholders. The dividend allows to consistently return capital to shareholders, regardless of industry dynamics. We have returned nearly $100 million of capital to investors through dividends since initiated in fiscal 2018. Last December, we increased this dividend by over 15%. Going forward, we strive to keep the dividend competitive to our peers and also intend to be more consistent with annual dividend increases. The repurchase program allow us to opportunistically reduce shares outstanding through open market purchases. Occasionally, changing ownership or market sentiment provide near-term opportunities to reduce share count and add value at the per share level. The repurchase program has added a tremendous amount of economic value to shareholders over the long term. Over the past few years, we have aggressively repurchased shares, which has depleted available cash in certain jurisdictions like the U.S. We are currently transitioning a sizable portion of our global cash balance in the U.S. in the most cost-efficient manner, where it can be utilized for the dividend, share repurchase program, U.S.-based M&A or incremental R&D spending. Finally, our financial framework currently only assumes that we will offset dilution with the repurchase program but does not assume any M&A or opportunistic repurchases, which we have engaged in over the past years. Considering these points, we expect upside in our longer-term financial framework on a per share basis. With that said, this concludes the financial discussion, and I will now turn it back to Joe.

Thank you, Lester. I'm now happy to introduce MK Han, our Vice President and General Manager of Products and Services. MK has driven the aftermarket products and services strategy and segment transformation since joining Kulicke and Soffa in 2017. After joining K&S, MK has enhanced our competitive advantage within the APS segment, driving market share gains, expanding our offerings and increasing recurring revenue. MK earned his Masters in Physics from the National University of Singapore and previously held senior positions at semiconductor equipment companies, including Mattson Technology, Lam Research and Applied Materials. MK, please go ahead.

Thank you, Joe, and thank you all for joining today. By fiscal 2024, we anticipate our aftermarket products and services, or APS business, to grow by another $60 million. This comes from 3 main areas: industry expansion, market share gains and the value-added services. There are a few key messages I would like to cover regarding APS business. First, APS allowed us to further increase our engagement with the customer, which helped us to understand their needs better. This feedback is key to drive the right product development to meet our customers' future needs and challenges. Next, we have reorganized the team and our strategy a few years ago. With a sharper focus, we have made meaningful improvement in expanding our product offerings to serve our customers and to grow our business. Finally, the growing challenges of assembly complexity and the broader challenges due to technology transition are opening up new opportunity for higher value-added products and services. Today, consumable represents just under half of our APS revenue. We are expecting this composition to remain more or less the same in the coming years. Consumable ARPUs used in the back-end assembly equipment: capillary, wedge and dicing blades, form our core consumable business today. The market opportunity for the consumable is expected to grow dramatically over the coming years, with the installed base expansion from the current aggressive ramp. Spares and services represent us over the other half of our APS revenue. This business is also expected to increase this forecasted high factory utilization, new form of assembly moving to high-volume production and increasing demand for value-added services by our customers. Our comprehensive product offering, together with our global service organization, enable K&S to win -- to help our customers to win. As original equipment maker, our in-depth equipment and application knowledge enable a very close working relationship with many customers. We are always the first point of contact to our customer when needs arise. The other key differentiator for K&S is our unique consumable offerings, allowing us to provide a very comprehensive solution together with our equipment. This unique combined offering received very positive feedback from many customers in our annual Voice of Customer survey. Our global presence in many countries near to the customer shorten our response time when the customer needs our support. Our close engagement and regular feedback from the customer help to drive continuous improvement in our product to meet their needs. Our outlook for the consumer business is very positive due to several favorable factors: first, accelerating demand from strong customer factory utilization; second, the installed base growth from overall industry expansion; and the new market that increased our served available market. These factors will provide multiyear growth opportunity to increase our recurring revenue. Why we win? Our consumables are designed and optimized for our machine to the joint development between the engineering team within K&S. We also provide a comprehensive consumable product portfolio for a wide range of back-end semiconductor SMB equipment. Our continuous effort to drive best-in-class [ yield ] and product quality, together with our application expertise, enhance our position to be the preferred supplier to our customers. With a strong business outlook, we continue to invest to further strengthen our R&D and high-volume manufacturing competency, especially in the area of advanced material development, manufacturing technologies and factory automation enhancement in our manufacturing hub in China. In the last couple of years, we developed a wider range of aftermarket product portfolio to serve our customer. Spare parts and service support continue to be the 2 key products serving our installed base. We have more than 250 service engineers and multiple warehouse at key sites. APS has also expanded our repair and refurb services to support our customer needs throughout the entire equipment life cycle. There's also an increase in the demand for technology and productivity upgrades to extend equipment useful life span and to lower the customers' COO. Our customized service program, K&S Cares, cover both labor service and spare parts, provide a comprehensive maintenance solution on our machine. This enable our customer to focus on driving manufacturing efficiency in their factory. Last but not least, we have extended our Industry 4.0 solution and have recently released a cloud-based KNEXT solution. We will continue to develop and expand this new value-added service solution to serve the changing needs from our customers. Our existing spare and service products from our installed base continue to form the backbone for our recurring revenue. However, with the growing complexity in the industry and our new equipment entering into new market segments, we expect a higher demand for our higher value-added services and solutions. This includes our broader K&S Cares services and KNEXT solution that support our customer transition to Industry 4.0 and factory automation, a new generation of bonder designed to be Industry 4.0-capable, which is called smart bonder. We have also developed a proprietary Industry 4.0 software platform, KNEXT, to enable complete machine-edge-cloud solution for our customers. Some of the key benefits and features for our KNEXT solution includes real-time advanced process control, customized visualization for user analytics and full product traceability to enable the development of predictive maintenance and effective process control. This new solution will open up many new and exciting opportunity to installed base in the future. With that, I end my presentation. I would like to turn the discussion back over to Joe for our next session.

Thank you, MK. Our next presenter has led many enabling innovations within semiconductor assembly. These crucial innovations, which are embedded throughout our capital equipment offerings, provide the industry with market-ready solutions that mitigate the challenges of 2-dimensional node shrink in both high-volume and also leading-edge semiconductor assembly. Bob has also played instrumental roles in enabling the broad industry's gold-to-copper transition, which has materially reduced semi conduction production costs and extended the value proposition of wire bonding assembly. Over the past few years, Bob has increasingly focused on next-generation mini and micro LED placement technology. Bob has been instrumental in the development of our current market-leading placement solutions and also the development of our recently shipped LUMINEX system. Bob also leads our next-generation advanced display road maps. With that said, it's my pleasure to introduce Bob Chylak, our Vice President and Chief Technology Officer. Please go ahead, Bob.

Hi, everyone. Today, I'd like to talk to you about LEDs at K&S. This is an exciting opportunity for growth of our baseline revenue. As you can see from this slide, we believe that by 2024, we can add about $150 million to that baseline from both traditional and advanced display. So this growth potential is for both traditional advanced display. But while our projected growth comes from both areas, today, I'll focus on mini and micro LEDs for the advanced display. So this is a significant growth opportunity for us, and we'll show the market data on a subsequent slide. We have a leadership position. We're entering this with an established machine, the PIXALUX. And we're working through partnerships, mergers and acquisitions and organic investment in R&D to maintain and solidify that leadership position for the future. We have already some key customer engagements for production of our PIXALUX in the field. And we're leveraging those, to build on them to get into mini and micro LED for more advanced displays. And we've created aggressive road maps. So we're accomplishing that through R&D spending, and we have several products in the development pipeline comprehensively to support these multiple opportunities. So if we go on to the next slide, I'd like to stress that mini and micro LED are complementary, and they will coexist in the future. They're -- we're intimately involved in the supply chain for both, and often, it's the same players. We're committed to enabling this industry transition as we see it as a great growth vector for K&S outside our traditional wire bonding and packaging. Many LED transfer technologies is extendable to micro LED. So as we are working hard on the mini LED, we're also providing the future basis for entering micro LED. So mini LED, its applications are ramping right now. It serves the high-volume display market. And this is because it -- backlighting for mini LED improves the power efficiency, the brightness and the contrast of LCD displays. And this is sort of a logical transition. It might be analogous to fluorescent lighting transitioning to LEDs a decade ago. So when LEDs first appeared, they started to replace traditional lighting and the adoption took a few years. And so the LCD industry is driving this adoption. For micro LED, there's R&D ongoing, and it's intensifying to solve the near-term industry challenges to drive adoption. So this will become -- in production for commercial displays and even mobile and wearables, and that will drive the future demand. This technology competes with other self-emissive technologies, such as OLED, but is brighter and there's no burn-in, and it has very high reliability. So micro LED applications will start to ramp in 2024 after the R&D is accomplished. So for the next slide, where is K&S? Where are we in this -- so today, we have a leading solution and the largest market share for ultra-fast final placement with our PIXALUX product. We recently acquired a start-up, Uniqarta, who we had been working with, that has laser technology. And that adds laser competencies to our development. So we are broadening our portfolio of next-generation of mini and micro LED market-ready solutions and working hard in R&D to do so. So this market for both mini and micro LED wafers is expected to grow at about a 55% compound annual growth rate over the next 4 years. So if you look at the time line on the next slide, we have a proven ability to rapidly intercept the technology trends. So in September 2017, we identified a new advanced display market opportunity. By August 2019, we recognized revenue for the first machine in this market approximately 2 years later. Another year later or so, we delivered the 100th PIXALUX machine to the market. And the following February, we acquired Uniqarta, who we had previously been working in collaboration with. And then just now, in September this year, we shipped our first LUMINEX machine. So we're positioned to enable widespread adoption of the advanced displays, and we've shown that we can commercialize products within about 2 years. So I've spoken about the PIXALUX, LUMINEX and micro LED so let's talk a little bit about the technologies behind them. So the PIXALUX is a mechanical transfer. You can see that the die are mounted on tape upside down and a pin mechanically presses the die down onto the PC board in [ solder paste ]. And we can do this remarkably quickly at about 50 die per second. But this is a mechanical process. And this mechanical process, while remarkably fast, is going to run out of steam. So we decided that we needed a new technology to gain higher cost of ownership, better cost of ownership, higher productivity. So we are developing and have developed the LUMINEX machine. So this is based on Uniqarta technology. We have the patented laser transfer. And I'll -- let me describe a little bit about how it works. So a laser -- there's a tape mounted on a fused silicon substrate, like a glass substrate, and the die is mounted on to that tape. The laser beam shoots through the tape, is positioned through the tape, and the first -- the tape is 2 layers. The first layer of tape is -- gets heated, it absorbs the laser energy and gas is formed in the sort of a mini explosion. And the second layer of tape contains that explosion. So it does not add debris to the tape. And that's the genius in this technology is that there's a little micro machine that can transfer the die very quickly. The laser pulse heats the material in only tens of pico seconds, and the die is transferred in microseconds. And -- as opposed to mechanical transfer, instead of moving a gantry mechanism [ camera ], this is all positioned by mirrors, galvo mirrors that can move extremely quickly. So the productivity of this machine can be much higher. And it's similar in nature because the die is mounted to tape. And then in the future, for micro LEDs, where an 8K display can have up to 100 million die LEDs mounted to them, we need much, much faster transfer. So we're developing the same technology, but instead of shooting 1 die across the gap on to a board at a time, we're going to shoot many die simultaneously. So that opens market potential for us. So if you look at this chart, this is a chart that shows how a display is made. So first, there's the epitaxy done in the fab, then dicing of the wafer and stretching of it onto a tape. And then these die have to be sorted and mixed because the wavelength of the die are not uniform. So die of the same wavelength need to be put on a new reconstituted wafer so that your eye cannot detect color changes. Then some -- if it's for an RGB display, the die are put on -- re-pitched onto a pitched array module, and then they're placed finally onto the substrate. So the PIXALUX today can do the final placement onto the substrate, but does not do the sorting or the re-pitching. However, the LUMINEX, with its better accuracy and laser transfer, can do the sorting, the re-pitching and the final placement. So this opens not just backlighting applications, but it opens RGB applications for both mini and micro LED. So if we go on to the next page, we can look at the market. So this market shows thousands of 4-inch equivalent wafers on the Y-axis in time -- versus time. And you could see that in 2021, most of the market are the backlight applications for mini LED. There's a small amount of self-emissive RGB. But by and large, the whole market is for backlighting. And you can see that, over time, the market grows for backlighting and self-emissive RGB displays and grows further, until finally, in 2025, micro LED emerges. So in this market, we have engagements with multiple customers, solutions in development or already available for backlighting and self-emissive displays. And so this gives us access to new process steps and increases our SAM by 66% by 2024. And this market growth, as I said previously, is 55%. And it's a huge and significant growth vector for K&S, and it's very exciting. So finally, let me compare the specs and the applications for our road map. So the PIXALUX is a backlighting machine. This is for premium displays. Our customer engagements are limited. We have partial IP. And the accuracy of the placement of these die is about 20 microns at 3 sigma, and our throughput is 50 to 75 per second. But the LUMINEX, the laser-based system, can do both backlighting and self-emissive displays. This is -- the end market will be mass displays. There's many customers that we're engaged with or are in the queue. We have full IP ownership. The accuracies of the placement is now below 10 micron. And we can achieve much, much higher throughput with the laser-based system, depending on the application, up to 1,000 per second. And then the self-emissive displays for micro LEDs, in the future, we've already engaged with several customers. We fully own the IP. We believe we can get the accuracy of less than 1 micron for the transfer of these dies. And in order to hit the throughput that makes this cost effective, we will extend this technology to throughput greater than 10,000 hertz. So with that, I'll turn this back to Joe.

Thank you, Bob. Our next speaker brings nearly 30 years of experience in the semiconductor and electronics assembly markets. Over the prior 20 years, he has driven sales, business unit strategy and operational execution within senior leadership roles at KLA Corporation and Form Factor. Prior to joining K&S, Chan Pin also served as Chief Executive Officer of Everett Charles Technologies. Chan Pin joined K&S in 2014 and has added a tremendous amount of value by expanding our automotive business into battery assembly and intercepting the advanced display opportunity. He has strengthened our position through organizational refinements within the wedge bond, advanced packaging and electronics assembly businesses and currently serves as our Executive Vice President and the General Manager of our Capital Equipment segment. While Chan Pin is ultimately P&L responsible for a complete capital equipment segment, today, he will cover the general semiconductor, memory, automotive and industrials end market opportunities. Please go ahead, Chan Pin.

Thank you, Joe. Well, it's exciting times now on automotive and industrial segments. We believe that these fundamental changes in the coming years is providing a huge growth opportunity for K&S. Looking at this slide here, we see auto growth, industrial growth, and battery interconnects contributing close to $90 million of incremental opportunities on auto and industrials. Some of the stronger positions that we have today in auto, with our core business in wire bonding, wire interconnect, battery interconnects, is giving us a very strong position as the leader in automotive back-end semi wire bonding. At the same time, we are also seeing growth of [ PHEV ], the average, especially in semiconductor content. And we continue to see this expanding dramatically in the coming years as the growth of electric vehicles continue to evolve. We are strongly engaged with a lot of lead customers in Europe, U.S. and Asia. And this ongoing customers' engagements is giving us extreme momentum in the semi for auto and industrial segments. We will continue to expand that market and continue to grow in this auto and industrial segments. Let's start with a history of where K&S started in automotive segments. In 2006, we entered the power IC market. In '17, we released the RAPID Pro. And we entered into the EA market after the acquisition of Assembléon entity in Netherlands. And then in 2021, we continue to expand battery solutions. We anticipate that in 2021, this is going to contribute over $120 million of revenue for both auto and industrial revenue. There's some competencies that we -- I'd like to highlight. As you can see, some of the pictures on the right, ribbon bonding. Ribbon bonding is an innovation developed by K&S, together with the [ Autodyn ] brand in the past of wedge bonding. We started developing what we call IGBT power modules for the industrials controls as well as the hybrid and electric vehicle productions. This has enabled very high volume, very high reliability electric vehicle battery assembly. So this is all coming very, very strong momentum in the last couple of years, and then we anticipate that this growth will continue to grow even more. Like I mentioned, we have very strong customer engagements, over 150 dedicated auto and industrial customers for both power and discrete solutions. We're also in the hybrid, power hybrid, which is the picture on this bottom right, the white power module. That's a power hybrid module. That's a simplified module. But in it, it's including MOSFETs and transistors, diodes, transistors in a power module, driving inverter modules for electric vehicles and power hybrid solutions. Alternative energy solutions is a segment of the market we continue to identify solutions to go into alternative energies. For example, like electric, hybrid electric, plug-in electric, solar storage power. These are examples of alternative energy solutions. The next slide basically shows a simple explanation of why the electric -- full-electric, is advancing faster than the original plan. As planned in the past, you can see in the dotted line, these were supposed to evolve in the next couple of years. But due to the whole carbon footprint reduction, CO2 reduction, incentive for zero-emission vehicles in China and basically a clear plan of transition from combustion engine to electric, these initiatives, driven from both regional government, institutional, commercial, has basically brought the curve forward. We expect that this is going to continue for the next many years, but the pull forward is going to be like 2 to 3 years ahead of going to full-electric. As you can see, many announcements from different automotive players announcing a clear strategy and plan going towards full-electric in the next coming years. Others that help K&S. Now let's look at the next picture, which is a very simple schematic of an electric car with a big battery in the center, high-voltage battery, a battery management to manage the batteries as well as communicate to the electronics in the modules of the car. And then importantly, on the lab, you see an inverter for AC and DC, and that's also using what we call the IGBT modules. And of course, you have the low-voltage, high-voltage converters, the DC to DC. And you can see on the left side, we have a picture of the wedge bonder we call the Asterion. It's targeted for applications in sensors, IGBTs, diodes, hybrid pack, MOSFETs and battery management. So in many applications, our wire bonder family, wedge bonder, specifically Asterion, has been driving very clear applications towards all these different applications. Now moving to the picture on the bottom, it's our core pick-and-place machine in, we call, electronics assembly. It's basically a combination of a line that consists of a high-speed pick and place called the Hybrid, coupled with the iFlex for different component size and placements. Now this is used for placing components on a PCB that's also used in many parts of the car -- vehicles. For example, what we've seen most recently is, for example, it's like the infotainment, the dashboards, where a lot of electronics, LED screens and all kinds of electronics are in the infotainment systems. And we see this as a big -- huge advantage of a high-speed automotive Industry 4.0 compliance in terms of supporting this industry. On the right, you can see a battery module. There's 2, basically, types of different battery modules that we've seen in the market. One is the cylindrical batteries and one is the prismatic. And again, we have been very strong in leading the cylindrical battery interconnect. And recently, we are also getting into certain engagements on the prismatic battery cells. The pictures on the right shows different wedge models that, again, supports the different applications for the electric car modules. So I think if you look at the header, right, basically, we see the semi content is going to continue to grow at least 2x to maybe up to 8x when electric vehicles is going full autonomous. So it's beyond the electric vehicles that we see adoption of semiconductor in power modules and electric vehicles. We start to see that beyond vehicles, a very key important component is the silicon carbide adoption for fast chargers in electric vehicles. And what we see that the need, the requirement to fast charge a car, 30 minutes, 40 minutes or less than an hour, becoming a very important point for considerations for adoption for electric cars. So what we have seen in semi is the mixed compound called silicon carbide, where it provides a much higher charging rate based on the mixed compound silicon carbide attributes. It has better thermal behavior. It has better electrical behavior, yet better contributions towards ability to fast charge a car within less than 30 minutes. So what we see here is that, for silicon carbide, you can get charging rates from the 350 kilowatts or up to 1,000 volts, right? And we start to see that many key leading customers of ours adopting silicon carbide in terms of the modules that uses our wedge bonders or wire bonder solutions. So we see -- we're going to see this also a lot towards the IPM, intelligent power modules, where it also has a system-in-package type of efficiency gain. And this creates, basically, a multi-chip modules within our power modules. And this gives advantage of integrating the logics as well as the power IC chips into a certain module, we call IPM. The picture on the right basically shows a 3-heat wire bonder, wedge bonder that shows how the multi chips can be wire-bonded using multiple hits to bond the different chips to the substrates or the lead frames. So this is one example. But we start to see that the drive for infrastructure is becoming more and more important. And as a result, silicon carbide naturally becomes a very important solution to this whole infrastructure of charges. Moving on, I'd like to just explain that we have been very focused on the cylindrical batteries for the last couple of years, driving very high-efficiency battery interconnect for cylindrical cells. The systems that we have right now are over 500 systems in cylindrical production. And it has been growing for the last couple of years and will continue to grow at a CAGR of 30% through 2025. And today, cylindrical battery interconnect represents close to 20% of all EV battery markets. And we believe that this will continue to grow even more in the next coming years. Now moving on. K&S is moving to the next-generation product, which we call a new laser-based cylindrical battery systems. And recently, we got qualified with a major battery manufacturer in North Asia. We have been shipping tools to them, and they have been starting to do battery interconnect using a later-generation wedge bonders. And this is going to be used in -- as large packs for commercial trucking productions. Moving on further below. The arrow pointing out is a new -- entire new offering called the prismatic battery solutions. As I explained earlier, the battery comprises mainly of cylindrical as well as prismatic. And now that K&S initiated to go into the prismatic, we believe that this is also giving us a very high potential market. It will represent close to 10% of our fiscal 2022 auto-industrial revenue. And one of the key markets we see is in Europe, specifically in East Europe. As you see, a lot of automotive players are beginning to have strong presence in East Europe to support the entire European market as well as international markets for automotive as well as going into the EV market. I'd like to hand over this time to our very key strategic customer of ours from Intel, his name is Mostafa. He is currently the Corporate Vice President and Director for Die Prep & Assembly Technology Development. He has been working closely with K&S in many different projects. He's got over 37 years of experience, leading transitions of assembly complexity. Mostafa, I'd like to introduce you, and welcome to our K&S Analyst Day.

First off, thank you for the opportunity to participate in this call. What I'm going to share with you is our views on advanced packaging and heterogeneous integration for creating system-level capabilities and -- in a package and also talk a bit about our partnership with K&S. Before I start, I need to make some legal disclaimers as some of the statements that refer to Intel's future plans or expectations are forward-looking statements. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. All right, with that out of the way, if you look at the history of semiconductor and computer industry over the last 40 years, a lot of performance has become available to a lot of people through several disruptions that have taken place. During the early years in the PC era, 1 billion devices were connected to Internet. And then in the mobile and cloud computing era, there were 10 billion devices connected to the cloud. Now with the compute becoming part of everything and everything getting connected and smarter, there has been an exponential growth in the amount of the data that is getting generated. But only a fraction of this data is being analyzed and translated to useful information, and this is driving an insatiable appetite for compute power. Now as we look forward, we are entering an era of exascale computing, when tremendous amount of compute power will become available to the masses with around 100 billion connected devices. And this will result in even a faster, call it, in data generation and driving the need for even more computing power and the network capabilities as well as storage. Now the question is that, how we can create and build products to meet this growing demand for performance and functionality that is driven by data-centric applications? And how to do it in light of growing cost and complexity of the silicon process node scaling? All right. This is where advanced packaging and heterogeneous integration comes into play by enabling integration of right transistors on the right silicon process node and creating a system-on-package with a ton more transistors that can be achieved from a single monolithic die. By leveraging advanced packaging technologies, we can overcome some of the limitations of the monolithic silicon by repartitioning the device and breaking it into tiles and chiplets. For one, this would allow us to remove the radical charge limitations by building products on multiple pieces of silicon. We can also build products by using transistors on different process technology nodes from different foundry sources and optimize for yield, for cost and for performance. And at the same time, we can shorten the debug and validation cycles and, as a result, shorten the time to market. Over the past several years, we have many players across the semi and computer industry. And the ecosystem have realized that the role of the advanced packaging is so critical in building better and differentiating products, and this has led to significant increase in R&D investments, investments in manufacturing, scale-ups and so on and so forth. Here, I want to share a snapshot of Intel's advanced packaging road map. As you can see, our portfolio is built around 2.5D and 3D interconnect technologies, with the goal of minimizing interconnect -- or maximizing the interconnect density and minimizing the power and the latency associated with the interconnect, and trying to get a performance level as if you had a monolithic piece of silicon in a disaggregated architecture. As you may know, EMIB is industry's first 2.5 embedded bridge that enables a very high -- very efficient and cost-effective interconnect in a 2D space. This technology has been in production for quite a few years. And we have a growing number of products that are being designed and built on this architecture. Also, Foveros, the next one is the first-of-a-kind 3D stacking technology that provides a very short interconnect with much higher interconnect density This one, same -- similar to EMIB, has been in production for a while. Right now, we have 2 other versions of Foveros technology in development as it has been announced by Intel in the past. One is Foveros Omni, which provides a combined direct silicon-to-silicon and silicon-to-substrate connection in a 2D space. The key attribute of this technology is that offers a path for further design flexibility and cost and performance optimization. And lastly, we have Foveros Direct, which leverages direct copper-to-copper bonding instead of using solder. As you know, this technology increases the interconnect density by an order of magnitude. One other point I want to make is that these technologies can also be combined in various fashions in a single package to create extremely powerful system-in-package type of products. I also want to show you some examples of our flagship products that are built on these architectures. Some of these are in development and not in the market yet, but some are. To the left, I have Intel's Agilex in an -- which is an FPGA product on EMIB technology, which integrates fabric, high-bandwidth memory and various high-speed I/O links from -- on different silicon technology nodes from different foundry sources. And in the middle, I have a couple of mainstream client and server products, which are currently in development, and these are built on Foveros and EMIB technologies. And to the right, I'm showing Ponte Vecchio, which was announced recently and is currently -- we believe it is industry's most complex system-in-package product that is built on a combination of EMIB and Foveros packaging technologies. And as you can see, in this case, we have around 47 chiplets connected through high-density and high-bandwidth interconnect to behave as if these were all part of a supersized monolithic device. And this product combines the layers of high-bandwidth memory, cache, high-speed I/O and compute tiles, all of these in a single package. One key message I want to convey is that, as you can see, many of the mainstream products across several market segments are now moving to advanced packaging and system-on-package architectures. As I mentioned earlier, other industry players are also investing in advanced packaging, and they're all trying to create heterogeneous interconnect platforms to integrate chiplets with the least amount of overhead, or what I call interconnect tax. And here, I'm showing a couple of examples from Samsung and TSMC. To the left, these are TSMC's 3D advanced packaging platforms. They use various interconnect schemes like organic redistribution layers or silicon interposer. They're also going to bring up a direct copper-to-copper bonding, per their announcements. These will have different optimization points for interconnect density, for power performance, for cost. And to the right, there are a couple of examples from Samsung's Cubs platforms. They use like TSMC silicon interposer for 2D. They also recently announced their X-Cube 3D platform using solar bumping and through silicon via interconnect. Now looking further into the future, the next barrier to overcome is integrating optical I/O in a package. This is driven by a number of factors like they need to increase the overall bandwidth, in particular, in data center space, or the fact that network power is increasing and is becoming a larger portion of the system power. Also, the need for -- to increase the reach of high bandwidth and high data rate connections. Now with core packaging of the optics, the optical ports and I/O can be placed near the switch within the same package as opposed to a plug-in connection to the system, which is that push that is out there today. What this will do is it will reduce the system power tremendously and will enable I/O bandwidth scalability. And by the way, this level of integration requires a lot of innovations in design, in equipment, in materials concerning the type of unique requirements and challenges for electrical and optical coupling and the fact that we need to reduce the amount of the losses to this coupling. Now looking at the supply chain and supplier ecosystems around advanced packaging, we are seeing some major shifts that are important to understand and internalize. For one, advanced packaging requires some of the capabilities that exist in silicon for back end. And as you may know, the boundaries for where the silicon wafer process fabrication ends and where the package manufacturing starts are blurring. For example, many of the prospects need to be in a silicon fab-level type of a cleanroom environment, like ISO 5, or the formation of some of the fine-feature size redistribution layers requiring patterning steps that are used in silicon fabrication. And most importantly, we need the types of hardware and data automation systems that exists in the fab environment to deal with a bit more complex flows and more stringent process and quality control requirements that are needed for these kind of technologies and processes. So to that end, we are seeing a trend where traditional front-end and back-end equipment, let's say, equipment and material suppliers' supply chain is converging. We are seeing front-end suppliers moving into the back-end space and making investments, a lot of investments, actually, and growing their business in advanced packaging space. And the back-end suppliers are investing in cleaner tools, higher-precision tools or investing in fab-like processes, either organically or through acquisitions. The other trend we see is the growing number of collaborations and partnership arrangements between front-end and back-end suppliers. They are realizing that this is a path to accelerate the rate of innovation and the need for creating more integrated, more of a turnkey solutions for their customers. We believe this is creating an unprecedented opportunity for suppliers to invest, to collaborate, to innovate, to differentiate and improve their business portfolio and keep on expanding -- taking advantage of these opportunities. Lastly, as a K&S customer, I want to make a few comments regarding our partnership between Intel and K&S. In our view, we consider K&S as a key strategic supplier and partner for Intel. And in our view, K&S plays a critical role in support of our current and future needs for advanced packaging. I want to recognize K&S' investments and an outstanding level of commitment from -- all the way from Fusen, his executive team and all of K&S' employees in support of our needs. We believe, based on years of working experience with K&S, they have a deep engineering bench and wherewithal who continue developing very well-engineered tools and capabilities. And we are very happy and excited about the kind of capabilities that they have provided to us. And these tools have become key enablers for our packaging technology road map and manufacturing. I mean, as we have worked together, we see continued improvement along the technology, quality, affordability and sustainability vectors. And most importantly, I want to recognize the efforts by K&S in support of our needs in a super tough COVID and supply-constrained environment, which, apparently, continues for a while. And we are, more than ever, dependent on K&S. And as we look into the future, we see many opportunities for collaboration, for investment and innovation to shape Intel and industry's advanced packaging road maps. Examples include -- I have listed a few, like copper-to-copper interconnect, optical packaging, as I talked about it earlier, opportunities on panel processing type of tools and also collaborating to develop more intelligent manufacturing and participating in Industry 4.0 transition. So with that, this concludes my talk, and thank you for listening.

Okay. Thank you, Mostafa. I'd like to now introduce the overall general semiconductor and memory landscape in terms of what K&S solutions is providing in the coming years, especially in the exploding growth of the semiconductor segments. We believe that, incrementally, that's close to about $300 million of incremental general semi and memory baseline opportunities. A lot of this is going to come from advanced assembly, industrial expansion, electronics assembly as well as memory. Now with the diversification of all our product portfolio, from wire bonding to advanced packaging and also for advanced display, we believe that we have created a new value across assembly markets. This has increased capital intensity of assembly and mitigating well-known strengths and challenges. It also offers multiyear industry expansions through diversified core competencies, both through organic and inorganic executions. Well, we have been winning new businesses, increasing market share with our leading-edge logic assemblies as well as core wire bond and electronic assembly markets. Similar themes to the previously I mentioned, we have very strong intimate customer engagements. We have a very strong track record in solving customer and industry challenges. Now let's look at the core competencies of where we are for electronic assembly first. If you look at the picture on the right, the graph shows that this is a $3.5 billion market, total electronic assembly equipment TAM. We are currently targeting a SAM of served market of close to about $800 million of capital equipment for advanced electronic assembly. Now the electronic assembly is going through a lot of innovation recently. We acquired Assembléon in 2015. It was previously a PE-owned asset, and we acquired for about close to 1x of its revenue in fiscal year 2015. We have fully integrated competencies to enhance advanced packaging offerings as well as enter into the mini and micro LED that Bob has previously highlighted. The development team has strong competencies and developed good offerings to expand beyond the acquisition since then. With that, we have developed very strong competencies in high-speed motion control, placement accuracies, throughput efficiency and better cost of ownership for our end customers. Now moving on, I'd like to mention about our core market in terms of the tech change and what's driving that outlook. As you can see the picture on the right, right, the wire bonder utilization, it's going close to up to, what, 90-plus percent, 95% utilization. We have a very high utilized installed base of over 200,000 of wire bonders in installed base. But with such high utilization, it creates easily roughly maybe about 30,000 of bonders. And with that increase in demand from fee utilization and semi growth, we believe that this will continue to propel our core markets in wire bonding. So importantly, what's driving that high utilization rates and the high semi content? What we have seen is that the chip modules traditionally has been a single chip, single wire -- single chip that's wire-bonded with multiple wires with different IO points. We've seen that in the last couple of years, when multi-chip has evolved exponentially because of more functionality, more packaging, more higher density into a package, we see that wire bond has increased tremendously in the applications for multi-chip modules. So as a result, with 1 trillion of semiconductors to be assembled, we see that as a 6.5% trailing of a 10-year CAGR. And we see that this is also giving us above-average growth anticipated through 2023. And again, many, many different reports that we've seen, 8 in 10 semi packages using wire bonder as the core interconnect technology. When multi-chip is evolving and being introduced into this packaging, we are also seeing that the same adoption of high utilization of wire bonder for multi-chips. Why do we lead now? We continue to have very strong R&D investments, commitments to continue our road maps for our core markets in wire bondings. Our customer engagements are very, very strong. We have leading customers in -- especially in Asia, in the U.S., in Europe and Southeast Asia. We have not only just offering wire bonder solutions, we're offering the wire bond together with the consumables as well as process know-how and process development. All this packaged together gives a customer really good end-to-end solutions in terms of developing new applications on wire bond. So as a summary, our incumbent positions is we have high productivity, we have high portability and we have high flexibility. So imagine when you're inside the factory when there are hundreds or maybe up to 1,000 of wire bonders sitting hour by hour, customers would always want to make sure that machines are running at a very high utilization rate, minimize any interruptions to the production in terms of downtime, so uptimes are very high. And importantly, it's portability, right? Take the same program that you have developed in 1 wire bonder and multiply it to 10, 20, 100 bonders without even tweaking any of the process parameters. And this is a huge advantage for K&S. Now another growth that's driving is 5G, and 5G has enabled a lot, a lot of push for higher data rates. So we start to see that in 5G that the demand will continue to increase as shown in the picture on the left, right? You can see that the CAGR of this is growing at 77% between '21 and '23. And at some point, half of the new smartphones is all going to be 5G-enabled, and which means that the amount of semi content will continue to increase. We anticipate it's going to grow of about 4% annually. So how is K&S involved in the solutions, right? That's more silicon content means, new modems, new RF, new millimeter-wave antennas required, base stations on top of 4G, higher silicon intensity, higher bandwidth networking. And then on the end device on the palm of your hand, you want to have more photos, more videos, higher resolutions and faster data rate transferring between the data centers and your phones or your mobile phones and also better edge devices. Now if you kind of look at what is the content of this package level high transistor density? We believe that Moore's Law, as it evolved to the last 2 to 3 decades, has kind of reached a point where transistors, we call -- basically fail to maintain the pace of cost and performance. As we all seen, the Moore's Law in the last several decades in terms of the transition density improvement, but then the cost and performance are not so far, I would say, matched to the level of that scale. So what we have seen that even with 5G now that advanced assembly or the introduction of advanced packaging is becoming more and more important in terms of driving solutions, at the same time, maintaining those cost benefits relative to the performance requirement. So we see that the multi-chip in 2018, only 20% of advanced package requirements is in general semi. But then in 2021, we begin to see close to 40% of wire bonded chip, multi-chip model is increasing the amount of content. And we anticipate by -- in the next couple of years, that 50% of general semi, 50% of that will be multi-chip or multiple systems and package level in the package. Again, this will continue to drive higher adoption of wire bonder for multi-chips also in -- as transistor continue to scale to smaller nodes and package density continue to increase. So complexity will increase this through value propositions, extends growth across the portfolio. It reduces the reliance on unit-driven capacity additions. And of course, complexity creates higher value for K&S because we have a differentiation in our product and solutions, which creates higher margin opportunities. So K&S solutions in general provides new levels of complexity for both high volume and very high leading-edge applications. Now let's move on to the high-volume semiconductor segments. We have connected devices in 5G, IoT, RF, spec memories like NAND and high-bandwidth memory and also for all kinds of optical and sensing, the camera modules, CMOS image sensors, the face recognition and also for security. Again, a lot of focus is on systems and package and multi-chip modules, stacked die wafer-level packaging. The picture on the bottom shows a suite of solutions from ConnX ELITE, PowerFusion, Premier, CIS solutions, iFlex and our high-end wire bonder RAPID series. This basically creates a huge broad portfolio supporting the multi-die package growth. Now for the leading edge, the 3 segments of the market is mobile, mobility, the application processes in it; the sensors in it, AI, edge devices, machine learning; and, of course, data center, rich in content and driving high data rates through heterogeneous packaging, silicon photonics. And this is basically driving, you can see the pictures below it, all the different advanced packaging solutions, the thermal compression bonding, the wafer level packaging, hybrid bonding, High Accuracy Flip Chip and, of course, lithography for the back end. And this is the picture on the bottom that shows the suite of solutions. The picture on the left is our High Accuracy Flip Chip. Picture on the center, it's APAMA, which is a very leading edge for application processes bonding, the APAMA series. LITEQ is for the lithography for advanced packaging. And then the flux-less, which is the next-generation thermal compression bonding. And of course, working towards a hybrid bonder in the coming years for even a high accuracy placement, for example, like copper to copper bonding. Now just a very simple schematic of silicon photonics in line with what Mostafa has also mentioned about the core package. The core package optics assembly is a very complex assembly that requires basically transceivers that integrates together with the silicon chips. So you would see a chipset with basically a fiber optics unit integrated into the modules. I'm not going to go into some of the details, but basically, the core package optics requires the PIC as well as the EIC, which is the photonics as well as electronics integrated circuit integrated into the chip. So what's driving the differentiation in our K&S solutions is our thermal compression bonding together with our formic acid or flux-less solution, right? This basically creates a winning formula for customers who's trying to create a package for silicon photonics and what we call in short co-packaged optics. And this is going to grow at 40% CAGR in the next couple of years. So this is another great application at K&S, provides a differentiated solution. So all the different applications on the right shows crypto leading-edge modules, AR display drivers, embedded logics, chiplets, these are all kind of driving more to advanced placements like the flip chip and thermal compression bonding. Now I conclude my presentation for the general semi as well as memory and the complexities of the future trends of packaging. I'd like to now turn the time to Lester, who is going to conclude in today's presentation. Thank you.

To summarize today's presentation, we provided many specific structural drivers to support a higher level of sustainable growth and profitability. Throughout our multiple end market opportunities, we expect roughly 1/3 of our fundamental baseline revenue growth to stem from a normal level of industry growth based on historical trends. Another 1/3 of the incremental baseline to be driven by above-average growth opportunities. These are apparent within automotive transitions, advanced display and emerging opportunities such as silicon photonics and co-packaged optics. The final 1/3 of sustainable revenue growth comes from ongoing strategy to take shares in areas, including the electronic assembly market, which provides a significant untapped opportunity. Also, transition for leading edge assembly are accelerating demand for our new equipment solutions, providing opportunities to gain share. Chan Pin has provided several specific cases that show how we are already actively winning at the turn within this ongoing transition. Additionally, we anticipate a period of multi-year industry expansion to continue as we move into the data era. 5G-related semiconductor demand is independently anticipated to drive demand for over 100 billion semiconductors by 2023, representing 4% of semiconductor growth per year or nearly 2/3 of the historical industry growth rate. This provides an opportunity to realize the same average profitability and cash flow generation levels that are inherent in our 2024 sustainable target model today. We believe these are all very rational and achievable targets as we look ahead. We have demonstrated a track record for setting and achieving realistic targets, both on a quarterly and long-term basis, including our prior 2018 Analyst Day targets and also through a very dynamic operational and supply chain environment over the past 18 months. We are very optimistic of the future based on our positioning. There are several industry and company-specific dynamics that provide paths for upside, which we also want to clarify. At the industry level, overall demand for semiconductors may exceed the historical 6.5% growth rate due to a more rapid global 5G rollout and growth in connected end devices. Also, the ongoing impact of work- and play-at-home trends and better macro conditions can also support a longer industry expansion period. Next, semiconductors nationalism across the U.S., Europe and Asia is driving additional investment in wafer fabrication. This is causing wafer starts to be higher in 2023. This desire of local control of the semi space is likely to continue into the long term and will ultimately help drive chip ASPs down, supporting a high demand. Ultimately, localization of the semiconductor market creates inherent efficiencies or a need for higher capital spending. These trends all provide local industries more confidence, supporting more consistent level of capital equipment spending and capacity expansion. These national focuses within the semiconductor industry are also directly driving above-average wafer starts into fiscal 2023, which will lead to further assembly expansion. At a company level, we also see potential upside in assembly complexity, advanced display and future inorganic growth prospects. First, within assembly complexity, faster transitions at the leading edge and also within the high-volume semiconductor markets can materially impact demand for our solutions. Additionally, our baseline methodology is inherently backward-looking and may not fully value the current incremental baseline improvements stemming from the recent acceleration of multi-die assembly. Next, a faster industry transition towards locally dimmable backlighting and initial volume micro-LED panel production can provide significant upside in the out years. Additionally, faster and broader adoption of LUMINEX throughout fiscal 2022 may also increase our outlook and potential for outperformance over the longer term. Finally, our strong balance sheet provides additional optionality for direct shareholder returns through our consistent dividend and opportunistic repurchase program. Additionally, we continue to be extremely selective on M&A as we prioritize our higher ROI organic initiatives, although now have more access to interesting prospects based on our new market reach and positioning. We continue to take a very prudent and long-term approach to capital allocation, which has added significant value at the shareholder level over the longer term. To summarize, we have a broad set of systems and solutions that are pervasive throughout the semiconductor industry. In many cases, we are the dominant leader within the market we serve due to our deep-rooted competencies from an engineering, operational and supply chain management standpoint. We are directly involved in several exciting industry transitions, providing the opportunity for market share gains and higher growth. K&S is an empowered, accountable, performance-driven organization that has demonstrated the ability to drive industry change, innovation and transition into new markets. We have now reached a new level of profitability, which we believe is very sustainable and creates a platform for long-term market outperformance. With that said, I would now like to turn it back to Joe for the Q&A.

Thank you, Lester. For today's question-and-answer section, we'll be prioritizing questions from our covering analysts, and we'll open the floor to other publishing analysts if time permits. Operator, please pull for questions.

[Operator Instructions] The first question today comes from Krish Sankar of Cowen and Company.

Congrats, Fusen and team, on a very informative and clear presentation. Really appreciate it. I have 2 questions. The first 1 is for Lester. Thanks for the new target model and the baseline revenue, how to think about it. I'm kind of curious, like obviously, you have exceeded your prior numbers. So if I do the math, is the way to think about it, if you're going to be earning over $6 at $1.5 billion, on the upside, every $500 million incremental revenue is a little over $2 in earnings power increment is the way to think about it? And on the flip side, given that there is a cyclical aspect to this growth industry, how should we think about the downside to your model? And then I had a follow-up.

So Krish, I think there is some cyclicality but we believe that at this level, the earnings are much more sustainable. And again, we're talking about an average of $1.5 billion over the next couple of years. There will be ins and outs just as there always is, particularly driven by supply chain constraints in the near term, wafer starts as well as other things in the supply chain, semiconductor supply chain. As far as upside, as I think I indicated at the end of the presentation, we do believe there is upside to the $1.5 billion. And this is based from again, maybe a faster adoption of micro, mini-LED, adoption of our LUMINEX tool as well as additional market share gains from SMT as well as the complexity, assembly complexity, which could be higher than we thought. Also again, as I indicated, there's macro factors as in semiconductor, what we say or call nationalism as people build alternate supply chains, which will create increased demand for capital equipment. So I think there is definitely upside. There will be some cyclicality. I don't -- again, we're going with the $1.5 billion average. I'm not sure we would actuate this downside. I think we've become very sort of rational and reasonable in terms of the way that we've built them from the baseline.

Got it, got it. Super helpful, Lester. And then a question for Fusen or Chan Pin. Your customer presentation, most of the presented are super interesting. Kind of curious, what do you guys do for Intel there? Are you in the EMIB or Foveros packaging technology? And on the longer-term question, Mostafa mentioned about supply chain convergence, and we saw last year BE Semiconductor do a partnership with Applied Materials on hybrid bonding. Is that something that you would consider where you might have to start working with the front-end folks in the future?

Thank you for the question. Yes, I think if you have seen the slide from Mostafa in his presentation, I think we're going across multiple devices across these different platforms, these packaging platforms, as shown in the EMIB, Foveros and so forth. Yes, we're going across because our machine platform is not specific to a specific product, but it's going across the different applications like I highlighted in my presentation earlier. So that's the first question that I answered about going across. And as they evolve, our machine will continue to also evolve in terms of high accuracies and higher productivity and so forth. And the second question about partnerships in terms of hybrid bonding or copper to copper, we're looking at all possible opportunities right now, including internal investigations and development in terms of our product line. So right now, I would say that since the road map is a little further out, we are investigating current road maps first before we kind of look external for partnership and so forth. But the requirements right now have been quite challenging in terms of some of the things, but I think our platform is ready to be able to meet some of the challenges ahead. So these are the answers to your 2 questions.

Thank you very much. Thank you. That's super helpful and informative. Thank you.

The next question is from Craig Ellis of B. Riley Securities.

And congratulations, guys, not only on a very insightful presentation today but on the prior target financial model execution. I wanted to start with a higher-level question, kind of builds on one that Krish asked, and I'll direct it to you, Lester. So it looks like the SAM is increasing dramatically from here to fiscal '24. And I think in many of K&S's markets right now, you've got about 50% share. But as the SAM grows to $5.5 billion as depicted in some of the slides, it would seem that would imply much more than $1.5 billion in annual revenue. So can you just talk about the expected share that the company would have in some of its growth assumptions? And is the company willing to quantify the potential upside that you might see to the $1.5 billion annually?

Well, thanks for the question, Craig. And as I answered to Krish, we do see there's upside. At this point, I think it's challenging to quantify a specific number on the upside. There is, again in the different vectors that we've talked about in advanced display and automotive, in general semi on the complexity. And again, I -- we do believe we'll continue to hold market share in our tier markets in wire bonding and also on advanced display where we are a leader. We are going to try to gain more market share in SMT, which we don't have as dominant market share as well as MK is going to grow market share in APS with the introduction of new products. So we do believe we're going to continue to drive growth across all businesses. But in terms of quantifying specific upside, again, we're very comfortable that we'll average $1.5 billion. We think there is definitely potential, as I indicated, to do better than that in the out years. But as a specific quantification, I think as we move towards that -- into 2024-'25, we'll provide more guidance to you and our investors.

And then my second question is a margin question so I'll direct it to you, and it's a twofold one. There's a 400 basis point gap between where we are now and the target model. So if we broke that down, what are the 3 or 4 main drivers that close that gap? And then on the operating margin side, it looks like the target model or the baseline model is affirming operating margin levels where we are now. So can you just talk about why more of that incremental gross margin leverage wouldn't fall through to operating margins?

So in terms of gross margins, I think the improvement is based on a few things. I think we're going to optimize our core business, and we're going to focus on designing for manufacturing, savings as well as for margin expansion. Also, we believe there's going to be growth in our higher margin, in our core business, particularly on our what we call the HP segment of our core business of wire bonding. In addition, our new products, such as advanced packaging as well as definitely in advanced display, those are the high-margin products. So if you put all those together, I think that's where the bridge is from the current gross margin towards the target gross margins I indicated.

And then why wouldn't more of that gross margin expansion fall through to operating margin, Lester?

Well, I think right now, it's -- we're perhaps being a little bit conservative. I mean, I think OpEx will grow over time. But even at these levels, I mean, these are incredible operating margins that we're delivering based on historical -- what K&S has delivered before. So I think there's also definitely upside on the operating margin, Craig.

Yes. And no doubt, they are very impressive versus history. If I could, I wanted to ask a more technical question to Chan Pin. So when I look at the automotive commentary around battery capability, clear historic strength in cylindrical and planned there in the future, but I believe really only 1 volume OEM is using that technology, and love to see that you're going into prismatic and that, that's led by European OEMs. But there's another battery type which is pouch. And does the company have any opportunity to move into pouch? If not, why not? And as you look at the growth over the next 4 to 5 years between prismatic and cylindrical, how does the growth break down because it seems like that's a pretty important driver for the company?

Okay. Thanks for the question. I think just to give some comments about cylindrical first, right? I think, yes, cylindrical has largely on a 1 key adopter in the market, but we have also seen that adoption has also gone into Asia. It's one of my points in my presentation, I highlighted that we recently qualified with a North Asian customer of ours, and it went into also cylindrical battery, right? So that adoption, not just stayed on one but it continued also in Asia, and we see a couple more also trying to get into cylindrical. Cylindrical offers a faster charge of current -- higher current density across, especially when you're trying to drive a very short current in a short time, I think the cylindrical offers a better offering than the prismatic. Prismatic, as I highlighted, it is our strategic direction to go into a larger market in terms of the European segment of the market and that we see across all the automotive guys in Europe, going across into prismatic. And this is why I focus a lot about the East European countries because that's where also the springboard for all the Western Europe geography for prismatic electric vehicles. I think pouch is a combo of, I would say, it's a mid-range between the prismatic versus cylindrical. We do believe that the prismatic line that we have shown in one of the pictures I have can be adapted to the pouch. But first, I think we're taking a step-by-step approach first and we are very solid right now in cylindrical. We're going into prismatic. We're going to establish ourselves in prismatic. And then if and when the engagement comes, we will adapt, modify our lines towards the pouch line. So that's kind of like the strategy, right? We believe that the next big growth will come from prismatic because of the adoption of prismatic into European car manufacturers, and pouch maybe some parts of Asia and also some parts of the Europe side. But in general, I think overall, battery, whether cylindrical, prismatic or pouch offers very high significant growth, as I've shown in my slide about growing easily, a couple X, like, 2x or 8x in one of my slides.

The next question is from Charles Shi of Needham & Company.

I want to follow up on the gross margin side. So when I look at your capital equipment versus APS, that the mix definitely plays a role in terms of the puts and takes in gross margin. And I look at your APS incremental revenue target, it kind of implies by 2024, APS is going to be like 17% of the total revenue, a little bit lower than where you were in '19 and '20, and yes, probably in line with '17, '18. So a lot of the margin upside has to come from the product. And you did mention there's a little bit upside from wire bonding, a little bit of advanced packaging, a little bit of advanced display. But in terms of these 3, can you kind of rank order where the margin -- gross product margin upside are going to come from? And I have a follow-up.

Well, thanks, Charles. As I said, yes, part of it is product mix as it always is with us, but also part of it is that we're making a concerted effort to kind of optimize the core business. And again, in terms of both the new products and the next generation of our core products, we're really designing in terms of to maximize the margin right from the start, as well as we're working very closely with our supply chain as well as with our operations to, again, maximize the margin going forward even at this elevated ramp level.

So Charles, I think your question, we believe that advanced display probably have a highest potential for the margin improvement.

Thank you, Lester and Fusen. That's very helpful. My next question is about advanced display. First off, a really clean product road map. Really appreciate the presentation there. I have a question. I think you're talking about $5.5 billion TAM or SAM by fiscal '24, 9% come from advanced display, which is about more or less $500 million TAM. But you're only like targeting $150 million incremental revenue for all the LED off a fiscal '21 base of mini-LED, I believe it's $70 million to $80 million. I think if my math is right, you're kind of assuming a little bit less than 50% market share in advanced display. Is that right? And where -- why you -- what about the upside opportunity, what they are?

So Charles, yes, I think next, I would say, 18 months will be critical for us to see more clearly. If we are able to push out LUMINEX to the market as fast as possible and get a very good result -- PIXALUX, we have a first in the market advantage, if we can establish this in LUMINEX. LUMINEX, the process capability is much, much higher than PIXALUX, right? You hear our processes, including sorting, mixing and repeating on top of final placement and with a much, much faster speed. In the future, for example, when a direct [ initiative ] come in, I think, in '24, just 1 big display needs to move 25 million die, if we are able to demonstrate leadership. At this moment, I think there are not clear leader except K&S in PIXALUX. If we are able to demonstrate this in the next, I would say, 18 months, then I would think the upside will be much faster. But at this moment, I think that's what we put into our forecast, as you calculate, probably roughly about 50% of market share. This can go higher if we demonstrate our advantage and well accepted by our customers.

The next question is from Tom Diffely of D.A. Davidson.

Thanks for the question and hopefully, Lester, this is your last model question. But I did have a question on the operating side of the model. Historically, you've had a very consistent model with fixed and variable and a lot of operating leverage. Curious, when you look at the growth drivers going forward and the product mix that it might entail, do you see any kind of meaningful change in the level of R&D or SG&A spending you need to do to support those new products?

Well, Tom, there will be an increase in R&D spending going forward, but not a significant increase, I would say. I mean, again, we -- as I said, we look at each project very carefully. And even though most of the projects are accretive, we generally try to tackle products with the highest growth potential and higher ROI. So I think there will be an increase in R&D as we look at the different vectors, as we identify new opportunities, but I would not say there's going to be a huge ramp up in terms of R&D. Also, as I think we've indicated before, as we move into new products, we also have R&D falls off products that we've already developed right? So for example, from PIXALUX into LUMINEX as well as from some of our core wire bonders, the lower-cost bonders now is going -- the R&D is now going into the advanced bonders.

Okay. Great, that's good to hear. And then, Fusen, maybe the follow-up question on the display side. When you look at LUMINEX, how do you think that rolls out over the next few years? Do you have to wait for a certain technology inflection point among the panels? Or is it just a matter of working with customers to get into their current product lines? And then ultimately, do you see this as cannibalizing the PIXALUX market as the main product? Or do you see a world where they both coexist side by side?

Okay. So I think you have 2 questions. Maybe your first question, I think the market is waiting for us right now for a mini-LED, right? So this currently if the lighting is the biggest market. And I think at this moment, it's really depending on our ability to roll out the LUMINEX. And I think the industry may be a little bit of micro-LED infrastructure need to be totally filled up. So mini-LED probably will be moved much faster beyond '24. But from now, I think the growth rate is going to be huge. I think we just really depend on our capability. So your second question is PIXALUX. We believe from now, maybe the 18 months or maybe next 2 years, would be the mixture of PIXALUX and LUMINEX. And because of productivity, LUMINEX will be much higher. So at a certain point, I think we will see clear advantage of LUMINEX and the revenue probably will be more towards the LUMINEX. I personally believe probably a year, maybe 18 months from now, in the next 1 year, probably we have a mixture of PIXALUX and LUMINEX. So for example, I think this year, we give a guidance of $60 million to $80 million for PIXALUX, right? Next year, we probably will also put about the same number. But we -- in the next few quarters, we will ship multiple system to multiple customers. So we do expect later part of next year, we probably will start to get sizable PO for LUMINEX and LUMINEX probably will go faster from there.

Okay, great. That's helpful color. And I want to thank everybody for just a nice presentation this morning. Great information. Thank you.

The next question is from Christian Schwab of Craig-Hallum Capital Group.

I thought that was a great explanation of the company and the future growth drivers. The model, I think, has been hashed over quite a bit. But first, I just have a big picture question for you. As we highlight and Intel has come and highlighted as well, just kind of the importance of back-end equipment supplier seems to be, in my opinion, much more important than it has ever historically, whether that's advanced packaging for -- with more chiplet package or customer adoption of silicon photonics and carbide or mini and micro LED. So with that as a background, Fusen, how do you see the back end evolving over the next 2 to 5 years? Certainly seems like more capabilities and scale and M&A would be very logical. Or do you have enough going on with all the opportunities that you highlight, we're just going to keep our head down and do what we're doing? I'd be curious, your 3- to 5-year kind of outlook as well as what you think could happen in the industry.

Okay. So I do believe our back-end will create more and more important load in the whole food chain. Moore's Law try to increase our transistor density just by shrink in the front end. But everybody know it's more and more difficult to scale down just by physically shrink. And in the back-end, we can increase transistor density in the back-end label. It's much, much economical, right? So I do believe back-end will grow actually faster than previous years, and that have been my prediction and supported by everybody's belief. So that's the first question. The second question, you're talking about M&A. So there's a lot of M&A we cannot control but we try to look at all the possibility. But I think at the end, the internal capability is at the most, right? We need to assume this should be a default, to stay along. I think this got to be our default, continue to increase our core competency, continue to invest in the adjacency. But when the opportunity comes in terms of M&A, we got to do the best for shareholders, right? We will keenly discuss with the Board to make a best decision. But I think at this moment, we have a very strong R&D team, very experienced. I think our road map, we see clearly. And I think we will do -- continue to do very, very well by standing along but we will entertain every possibility.

The next question is from Craig Ellis of B. Riley Securities.

I wanted to start just by coming back to LUMINEX and I know there's been considerable discussion in the Q&A, but I wanted to take a different view and see if I could get Bob's input on some of the comments you made about customer engagements. Bob, can you provide us any color on where that's happening regionally or the type of customer and as you're working with different types of customers, any color on where you've got more confidence in near-term to intermediate-term ramp pacing? You probably can't name them specifically, but any qualitative color would be helpful there.

Yes, sure. I can talk a little bit about that. We have customers in Asia, Taiwan and China, primarily that are LED manufacturers and display manufacturers. We also have European customers. Actually, our list of customers that are sort of queuing up to evaluate this technology is longer than we can actually deal with at this point. So we're picking and choosing the largest and the companies that are already into working into the displays for many LEDs that want to expand their -- increase their productivity, lower the cost of ownership over what they can presently achieve. And we also are trying to align with customers that are -- have road maps that move them into micro LED. So generally, we have a short list of a number of customers that are trying to do both. Does that cover your question?

Yes, that's really helpful, Bob. And then for my first follow-up, I wanted to bounce back to Chan Pin. One of the things that surprised me in one of the slides that you showed was that for multi-chip packaging, the rate of growth will slow. As we look ahead, it was 20%. I think that was in either '18 or '19, 40% now. And so we doubled and we're going up to 50% by 2024. And yet we've got multi-chip as the strategic imperative for TSMC, Samsung and Intel. So I thought we might see a higher number than 50%. So the question revolves around why we wouldn't see something that's higher than that. Is it that we're just so highly penetrated already in smartphones that other applications just don't have the units that can push us above 50%? Or would we more likely see something above 50%? And if we did, what are the implications for growth and margins, given the company's strengths in this area?

Okay. Multi-chip is definitely one of the key strategic growth areas for K&S as I have shown in my slide to about the growth from 20% to 40% to 50%. And you're right there, the potential, there's a lot of upside in the potential of greater than 50% in terms of how transistors or how packages are being compact and developing the multi-chip, right? So there is also a transition from wire bonded to advanced packaging, right, either flip chip or thermal compression bonding or eventually maybe hybrid bonding. So that transition will also create opportunities for K&S, as shown in my advanced packaging portfolio with flip chip, thermal compression and eventually, at some point, hybrid bonding, right? So those will create opportunities for growth. It will also create opportunities for margin growth. But right now, we see, like I mentioned in my slide, 80 to -- 8 out of 10 devices are wire bonded. And a lot of that is growing on multi-chip because today, multi-chip continues to be -- sorry, wire bonded on -- multi-chip and wire bonded continues to be the most mature, proven and cost-effective platform. And we still have a very, very clear road map in terms of our wire bonded technologies to address some of the accuracies and find which needed. So that road map will continue. But at the same time, we also have the flip chip and the advanced packaging platform to be able to enable opportunities of the transition from wire bonded to flip chip or advanced packaging. So I think both will offer growth opportunities as well as margin opportunities for both -- for K&S as we continue to invest in our road map for our products.

That's great. Go ahead.

Yes, I think it can be 50%, can be 60%. We just cannot put everything at a very, very high number. But I do believe the ball bonder now is still the most dominant way to do interconnect and it's the most economical way. And we have high confidence. And if market shares continue to increase, we will be the one to grab opportunity.

That's helpful. And then my last one is for MK. MK, you talked about the consumable growth opportunity within APS. And my question is, what's the attach rate? What's the share that the company has in that area now? And as we look forward towards realizing $60 million of growth, what needs to happen with attach rates and share to drive consumables portion of growth towards $60 million incremental?

The consumable business is a very competitive business, where we have quite a bit of competitor. So as I mentioned in my slide, so we invest quite a bit on R&D. So this will help us to always drive new products or better products to improve the cost of ownership. At the same time, we also invest in the Suzhou factory. So in terms of factory automation, in terms of new manufacturing technology to make our parts cheaper. So I think this will all help us to be more competitive against our competitor in the market. So I think our capillary branches for [ the platform does wonder ] for all the key driver to help us to drive this business. I hope I answered your question.

Got it. Appreciate all the color.

[Operator Instructions] Our next question is from David Duley of Steelhead Securities.

I have a couple. One of the assumptions, I think you made in your base business is unit volume growth of around 6.5%. If unit volume growth comes in higher, let's say, I'll just think of a number, let's say, 10%, is there a way that you can help us quantify what the base business would be under that scenario?

So Dave, again, it's very hard to quantify. I mean, we say we -- the assumption is 6.5%, right? But then I think in certain of our product lines, we believe that the unit growth will be higher, for example, in automotive as well as in display. So I mean, it's I would not say it's a straight line. If it's 6.5%, it goes to 10%, we double. But I think if it's at 10%, then there's definitely upside, right? I mean, you look at what the growth has been over the last year or so as we catch up on under-investment, you saw what it did to in terms of our revenue growth. So again, I don't really think that we're in a position to give you a specific metric to tie to if it was 10%, but obviously, it acts as an accelerant in terms of our revenue.

So David, maybe I'll answer very quick in a different way. In 2018, actually, we predict the model we have, we will achieve $1.2 billion, I think, in 3 years. But unfortunately, I think we have 2 down year, right, '19. And we have a downturn, start with the U.S.-China tension, then we have pandemic. But amazingly, '21, it's turned out the market has the ability to correct itself. So a period of time, I think is significant below the EBIT, it will be pick up at another year, right? So if you look at it, I think a 6.5% probably can be higher, for example, from 6.5% to maybe 7.5% is possible. But in the long term, probably EBIT of 10% maybe it's not so easy to be sustainable, right? So that's my answer.

And then I noticed in the presentation, the new LUMINEX tool essentially addresses 3 production steps, I think, final placement and sorting pitch adjustments versus the current tool, which only does the final placement. How much does that add to the TAM, adding those 2 additional steps that the new tool addresses?

Yes. I think the -- so can I -- this is Chan Pin here. Let me answer the question, Dave. So if you look at the slide, right, so there is the sorting mixing. So let me just explain very simple. This tool can address front-end die manufacturer who makes LED dies. So that's 1 segment of the market. In that market, we believe, is about $100 million SAM right now at this point, estimate. And then the other market, which is the panel makers, that final -- puts the final die on the final panel, whether it's a glass or substrate. And that's a $200 million SAM right now, we estimate, right? So we used to be able to address the back end, which is the panel. But now these 2 expanses of applications for both die manufacturer as well as panel manufacturers. So the SAM basically increases from just the back end to both the die end as well as the back end.

Okay. And then just 2 financial questions. I guess, first, with the gross margin kind of optimization strategy that you're working through, I understand higher volumes and new products are going to help the gross margins, I imagine there's some other things going on like introduction of new lower-cost tools and whatnot. I'm just curious when in the core business will there be a new lower-cost bonder coming? And what's the timing of that? And then the final question for me is just with $6 in earnings that you're kind of presenting here, could you just help me understand what the cash flow from operations might be with that level of earnings? And congratulations, this has been a great presentation. We really appreciate the information.

Well, thanks, Dave. Sorry, can you repeat your last question? I didn't quite catch -- sorry, there's a little bit of static on the line. You said about $6 EPS, what was the question, sorry?

Yes, if you produce $6 in earnings like you're presenting in your presentation, what is the cash flow from operations on an annual basis roughly going to be?

The tax?

Cash flow.

Cash flow from operations.

Cash flow. Well, I think the cash flow would be over $350 million approximately, if we do it at that level. And then as far as your first question is concerned, I think we always introduce multiple products in our core business. And also it's true, we do try to drive the margins up to design as well as other things. So I think going forward, there will be an introduction of both a more advanced ball bonder as well as a more cost-efficient ball bonder. And I think the time line for that will be in the next 12 to 18 months.

I think in the road map -- as I said, right, both core wire bonding and advanced packaging, we have concurrent road maps driving either efficiencies or miniaturization of final page, right? So advanced packaging has, like I mentioned, a flip chip going in a couple of microns like 3 microns and in thermal compression, about 2 microns and eventually when we get into the 1 micron space, potentially a hybrid bonding, right? So each of it has addressed a road map that's aligned to the back-end semiconductor road map.

That concludes the Q&A session of today's call. I will now turn the call back over to Joseph Elgindy for closing comments.

Thank you, Brock, and thank you all for joining today's call. Please don't hesitate to reach out directly for any clarifications regarding today's presentation. We look forward to providing future updates as we continue to set new targets and achieve new milestones. Brock, this concludes today's presentation. Thank you.