ASML Holding N.V. (ASML) Earnings Call Transcript & Summary

February 11, 2021

Euronext Amsterdam NL Information Technology Semiconductors and Semiconductor Equipment conference_presentation 38 min

Earnings Call Speaker Segments

Alexander Duval

analyst
#1

Hi, everyone. I'm Alex Duval. I'm the Head of Europe Semis research at Goldman Sachs. Delighted to be here with Peter Wennink, the CEO of ASML. Thank you so much for dialing in today. And really appreciate, Peter, you joining us.

P. Wennink

executive
#2

It's a pleasure, Alex.

Alexander Duval

analyst
#3

Great. So maybe we can kick off straight away with some questions. And I guess, first of all, maybe you could set the scene for us a little bit for 2021. How should we be thinking about the key trends as we look at areas like Logic and Memory? How do you think about the near-term drivers in 2021 for those areas across your business?

P. Wennink

executive
#4

Well, thanks, Alex. Well, it's a very relevant question because the news we're all reading is about semiconductor and chip shortage. So what does that mean? I think we need to realize that I think there are 2, that the current demand for product for ASML is driven by 2 trends. I think one is I would call an upgrade on the secular trend. The secular trend, of course, we already knew it, that we're in a growing business. But I think what the 2020 -- the year 2020 and the COVID crisis has taught us is that the secular trend, I think we're underestimating it because we're now seeing the benefit of the digital revolution, I would say, the additional transition and we're experiencing ways of communicating and delivering services and products that have accelerated at a very high speed, and it's not going to go away. So I think that will stay. That secular trend is definitely there, and that's a big driver of what we see today. On the other hand, we also see, on top of that, we see the effects of the 2020 concerns that our customers had starting at the end of Q1 and trending into Q2 and Q3, and in the first month of Q4. I think it was only until November-ish time frame that we really saw the demand picking up. And why is that? Because they basically effectively at 8 months or 9 months of concerns about the impact of the GDP growth we saw export control measures being taken, for instance, Huawei, which had an effect on the capacity planning of TSMC. We saw the news out of the United States, coming from big microprocessor maker, Intel. It all had its effect on the toning down, I would say, quite significantly, the capacity indications for 2021. Well, if you do that for 8 or 9 months, and then suddenly you come back and you -- and basically, the estimates, the early estimates on GDP shrink were exaggerated. And finally, in the end, and especially for our industry, it turned out much less worse than people thought. So we underinvested and that comes back. So that is -- on top of that, there is a higher secular trend. That's what we're seeing everywhere. I think memory that we see is specifically illogic, and it's across the Board. It's across the Board. It starts with mature technology, 90 nanometer, 65, 45, 28, it's everywhere, up to and including, of course, the leading edge. So the fear of not being able to fill the hole that was created by Huawei on the leading edge quickly filled up, filled up with all the customers. And now on memory, memory is trending the way that we anticipated. I think memory customers, and especially in DRAM, which is basically a virtual oligopoly, they actually started to manage the supply-demand balance by the idling tools. And the supply-demand that is starting to recover in the course of 2020, and we actually said throughout 2020 that the utilization rates we saw in the installed base in DRAM were going up, and we anticipated by the end of the year that would reach about maximum, which was about right at the end of the last year, early this year. But our memory customers, DRAM customers specifically, they anticipated this and they asked for machines in Q4 last year, which are being sold as we speak, which will generate in our output in this quarter and early Q2. Now if you take 20% bit growth in 2020, then that capacity addition that we shipped last year, which is now being put to work, is not enough. So we definitely need to see more shipments, DRAM shipments throughout the year to make up for that 20% bit growth. So that means that, yes, we have a very strong and not only bullish, but I would say, as a logic industry that is under -- that's in undercapacity, clearly, we have -- as a DRAM industry that is set to order more throughout the rest of the year for shipment throughout 2020. And I think somewhere down the line that 3D NAND will also follow, which is not at the same level of, I would say, utilization as we have seen with DRAM towards the end of the year, early this year. So they still have some, you could say, capacity buffer from a little point of view, that needs to be filled before we see -- we're in same territory as we are with dealer. So that's the picture. And that picture actually shows quite a significant year 2021 for the equipment industry.

Alexander Duval

analyst
#5

That's very clear. So that sounds very exciting, obviously. And I guess, just as we sort of think about quantification, one thing that sort of struck us is obviously some of your peers in recent weeks. They talk about sort of mid-teens kind of growth for wafer fab equipment this year. And obviously, given the EUV story, we think of ASML very much as a share gainer. And I think you've also talked about EUV growing 30% this year, which is actually an upgrade on what you had before. So if the market is growing that much and you're gaining share, how should we think about the sort of 12% roughly that some people think is implied by your guidance? To what degree could there be upsides to that? And what kind of conservatism may or may not be baked into that at the moment?

P. Wennink

executive
#6

Well, there is conservatism in there, and that's clear. And that's on 2 fronts. I think it's on logic. I think it's on mature logic, so there's not EUV, it's deep UV. EUV will be limited by our supply chain. It's deep UV, particularly China, but also now popping up in other places. And it has to do with the shortage that you can read about. So it's not only 7 or 5 nanometer shortage, it's across the board. That's definitely upside. That's still continuing in terms of demand. Now China is pretty important there because coming out of 2020, and especially the last couple of months of the former U.S. administration also presented us from time to time with some unexpected regulations coming out. And it's a bit skittish of what does that mean going forward. And we've been, I think, a bit cautious on guiding the Chinese logic market. Now under the assumption, as we said during our call, under the assumption that those export control rules as they are today, yes, we definitely see -- and it stays this way throughout the year, that means we can ship certain level of deep UV tools to China, which would actually be upside to the 10% that we guided. I mean, if you think about 600 million, 700 million on top of that, yes? On top of that, in DRAM, I just mentioned to you. I mean, our DRAM customers are customers that very closely look at the market dynamics. They are not like leading edge lethal or let's say logic maker because that needs a plan 1.5 years ahead in terms of capacity addition. They follow the market more closely. And of course, since it's largely deep UV, it also means that shorter-cycle times, shorter interval lead times for us. So we can actually follow the demand that's popping up now for shipment in the second half of the year, we can actually produce it. So that's another upside. And specifically, in DRAM and towards the end of the year, it might be 3D NAND, but I think this would be too early. So I think there are 2 categories of upside. One is, I think, deep UV mature logic, China, but also now starting to appear outside China and DRAM.

Alexander Duval

analyst
#7

That's very clear.

P. Wennink

executive
#8

Both deep UV.

Alexander Duval

analyst
#9

That makes a lot of sense. And obviously, you see customers raising CapEx and so forth. But some investors do ask us, the world feels very good right now. But are there risks of cycle overheating? Or double ordering, these kind of cyclical risks? Is it really just too early to be thinking about that? How should we sort of conceptualize where we are in the cycle right now? Is it just that the structural trends are so strong as well as the cyclical?

P. Wennink

executive
#10

Yes. I think the cyclical part is definitely not investing in 2020 creating under capacity, you could call that cyclical. That is just a short-term movement driven by external factors that turn out to be different. And then people say, "Well, oh, we got to grow, we need to do something different." I think the underlying secular trend is very clear. I mean, if we think about the demand for 90 nanometers, 65, 45, 28, it's microcontrollers, it's image sensors, it's image signal processing. It's a lot of stuff that actually doesn't need 7-nanometer and 5-nanometer, but it's fueled by it. If you think about the driver assistant features, it is not only -- it is, yes, it's 7 nanometer, and it's 5 nano, but it's also very much the other stuff. It's the analog translation into digital, which were just not 5 nanometer. So it's kind of the leading edge is the catalyst for the semiconductor demand that's growing in the mature business, and it's not that there's 1 or 2 players that are investing a lot in the mature business, it's many smaller customers, European customers like STMicroelectronics, Infineon, NXP, UFC, they're everywhere, that add a few tools, but many customers adding a few tools and wants some extra capacity adds up. And it's next to the catch-up of the underinvestment. It's really the secular trend. And is driven by the fact that we have 5G that we are rolling out 5 and 7 nanometer, which is fueling or exploring the demand for the mature logic. These are system solutions, which actually affect all the nodes, yes? Not just the leading edge nodes.

Alexander Duval

analyst
#11

That's really clear.

P. Wennink

executive
#12

So yes. There's some short-term-ism in there, but I think the underlying trend, which is the most important trend, is more secular. It's more long term.

Alexander Duval

analyst
#13

That's great. And obviously, you're talking about sort of broad-based demand from the more mature nodes up to the sort of leading-edge nodes. If we think about leading edge and sort of technology, obviously, EUV very much plays into that. I wondered if you could talk about the sort of latest improvements on the EUV technology that you're really focused on? And what the sort of feedback from customers is there? And clearly, you have an e-model that will be sort of becoming more and more prominent. Can you talk a little bit to the sort of financial implications of that as well in the context of those EUV technology improvements?

P. Wennink

executive
#14

Yes. I think if you look at the cadence of technology improvements, it's about every 2 years there's a new model. And the new model should provide much more value to our customers because why would they need a new model otherwise. So it's about higher productivity, but also very important is not only higher productivity. The uniformity of the critical dimension, which is an optical feature, is also very important. So CD uniformity is also very important with the next node because it keeps shrinking, things are getting small. But also then, if you do that, overlay becomes critical. So the combination of overlay, CD uniformity creates this, what they call, this edge placement era, which is a very important driver for yield and therefore, cost. So this is what every new generation, the specifications are tighter on everything, more productivity, better CD control and better overlay. And that's what you'll find back in every new generation. So the D version, which we're going to ship in the second half of this year, well, in 2 years after the second half of this year, so we talk about the second half of 2023, there will be a new version, it's called the E version, let's call it the E version. And 2 years later, in 2025, you see High-NA. So it's this 2-year cadence, which actually follows the cadence of leading logic makers and not particularly TSMC. So it's all driven up because we create it because the customers demand this. So we come up with these solutions to cater for the requirements that customers need for their next nodes. That's how it works. So it's this 2-year cadence. That's what we are seeing. And we -- what you will see is, of course, productivity advantages, but also overlay, which will create more value. Like you've seen, the ASP going up from about EUR 130 million to EUR 160 million coming from the C to the D version, which is about a 50-50 split this year. But in 2022, you won't see C versions, there's only D versions. And in 2023, you'll probably see D versions split with E versions. And so this is how it is, about a 2-year case.

Alexander Duval

analyst
#15

Got it. That makes total sense. And I'd love to talk a bit more about EUV and the plans there. But before we come to sort of unit shipments, and those kind of topics. You mentioned China and obviously, you talked about the implications for this year. But as we think longer term, obviously, China being keen to sort of build out their capabilities in the semi space. What does that mean for sort of ASML? Should we be thinking leading edge nodes? Should we be thinking logic memory? How do you think about that TAM in terms of those Chinese domestic players in the longer term?

P. Wennink

executive
#16

Well, I think, medium term, the next couple of years, I think China, where they are today, where Chinese customers are today, they'll have a significant task in just catching up from, let's say, 28 nanometer to 14 from 14 to 10 to 7, and basically trying to do what others have done in the logic space is just push deep UV technology to the limit, which will take a couple of years. So I think it will be predominantly deep UV. I think on EUV, we all know, that has a big question as to whether governments will allow us to ship EUV to China. But I think where the Chinese customers currently are, I think they need deep UV. Many of those customers, like, Wow, they're not a 10 nanometer, they're not a 14 nanometer. I mean, they are 28, they are 45 and 65, and this is where the demand is. So I think China will probably play a very critical role in these more mature solutions. While we are moving towards the, let's say, high ends of the deep UV applications, that's what will happen. Shipping EUV to China is such a hot political, geopolitical debate. It's almost outside -- it is completely outside our control. Now what does that mean? It actually means that Chinese customers will very likely be able to buy products that are made with 7-nanometer technology or 5 for that matter and just be made somewhere else. So I think from -- if you're a key supplier for that kind of technology for an industry that is global, or just ship it anywhere where it is allowed to make those devices. So I think longer term, it doesn't really matter. Short term, this is why we focus so much on, let's say, standstill on the current export control measures because when suddenly this export control measures are created or are changed, it creates disruption, short-term disruption. Medium term, it will just balance itself out. It just moves somewhere else. But shorter term, customers of Chinese foundry, they need to -- where they can't get their wafers made with the right level of technology, they need to start requalifying with another supplier, which will take time. And so short -- there'll be short-term disruptions. But medium term, chips need to be made, and then it will be made somewhere else. But China, really focused on deep UV.

Alexander Duval

analyst
#17

Very clear. And obviously, you touched on EUV there again. I guess if we think about this holistically, I think some people are thinking about maybe 50 units in 2022. I wondered if you could talk a little bit to the situation there, both in terms of what needs to happen from a supply side to an ASML side of things and perhaps the supply chain? And secondly, demand. Does it really hinge on any given customer placing a big EUV order? Or is that sort of fungible demand that could come from others? How should we be thinking about the supply side and the demand?

P. Wennink

executive
#18

Yes. I think on the demand side, to answer that first, I think it's not just one big customer. I think it's more widespread because you will see 2022, 2023, in that time frame, also starting to increase the number of shipments to the memory business to DRAM, which is not only Samsung, it's also SK Hynix, and it will be Micron also. So I think this is going to spread out just like in logic, it's going to be logic leaders, all 3 of them. So then you have 6 customers that want EUV for HVM. Well, that's not just one customer. So now it's just a question of where are we able to supply? Now going back 1.5 years ago, when we -- at the end of 2019, when we had no knowledge of COVID whatsoever, yes, we were planning 50 units for 2021. The fact that we aren't able to do so because 2020 saw a quite significant reduction in the demand because of the reasons we talked about. And we basically said, we're not going to take that complete risk ourselves. So we reduced the demand on our supply chain for shipment in 2021. And this is where we are today. We simply lost the time to go back to the supply and say, could you please give us more lenses and more drive lasers, because they simply didn't plan for it. We lost 8 or 9 months. So with the integral lead time being what it is, it just moved into 2022. So we were -- my answer is we were already prepared to do 50 in 2021. But because of the circumstances, we actually delayed or shifted back and we were not able to catch up to that level. But we have with people capacity, square meter capacity, and I am convinced that our supply chain can also do the 50 or 50-plus for 2023.

Alexander Duval

analyst
#19

That's very clear. And if we look out a further year, I mean, obviously, as you mentioned, there are all these customers that are going to be ramping up, well diversified in that sense and wanted to get the benefits of EUV. So as we look forward to sort of 2023, how should we think about a step-up in terms of units there? What kind of ballpark are we talking? And what does that mean in terms of the ASML CapEx or spending required on that? What would need to happen for a further step up if that's indeed what we could expect?

P. Wennink

executive
#20

I think what [indiscernible] CapEx not much because the CapEx has been spent. I mean, like I said earlier, we have the people and the capacity. I mean, we're hiring people because we need some more. But that has a variability of lead time, which is manageable from, let's say, the timing point of view. But I think we have everything. It's just a matter of making sure that the supply chain can follow us with 50 or 50-plus. But I think that's the clear plan. I mean, from a demand point of view, you always have to be a bit careful because nobody has a crystal ball, what it means. But if you look at the roadmaps of our logic customers and DRAM customers, all the advanced nodes, they need EUV shipments in 2022, 2023. Now the question is, to what extent do they need it? And then I go back to your first question, what is the secular trend looking like? And I think in terms of our simulations, when we look at the market, and we do this by using corridors for a low market, mid-market and high market scenario, I think we're testing now, of course, more towards the high end of those corridors. And that's what we're seeing today. I mean, I -- the answer to your first question was, I think the secular trends are moving up, which also means that these corridors, these capacity corridors are being tested. That's why we need to figure out in the time frame, if I said, between 2025, 2027, what's the new corridor? And I think it's something you, of course, would like to have a scoop now. I don't want to tell you what that is. But we'll probably like to preserve that for the Capital Markets Day, so -- and give you some more background information on that. But this is the trend, yes?

Alexander Duval

analyst
#21

That's very clear. Clearly very interesting longer-term trend. And staying on the EUV topic, you mentioned sort of memory adoption there. I wondered if you could give a bit more color about the sort of thought process customers have in terms of the benefits. And how you see that story maybe playing out in the next few years?

P. Wennink

executive
#22

Yes. I think the trend has been that the number of EUV layers is trending up. And one particular customer said they actually gave us some indications and they said there are all the reasons except productivity and cost, why we want to use EUV, for instance, with -- if we can't take out as a notable patterning layer or a double patterning layer, we have -- we're basically able to eliminate more or let's say, to eliminate stress in the wafer and in the device, which are huge considerations. And this is what we've seen, the electrical characteristics of the devices are better, which also means that the distribution across the wafer of better yielding dye is a bit higher, so it's not only productivity. It's also yield. And of course, yield issues or yield data is very well protected by our customers, but we do get the qualitative feedback on what they're seeing. And I think that's the main driver why these layers are going up. And now, of course, there's somethings leading, SK Hynix following and after that Micron, which, by the way, we also been the trend in deep UV. Assumption was the most aggressive in the innovation. And then SK Hynix following close and then Micron following. And in terms of little aggression, it could happen in other ways to create value through architecture or through other process steps, but for lethal, yes, we've always seen this sequence in terms of companies. And it's not different in EUV.

Alexander Duval

analyst
#23

Got it. And when we think about the sort of gross margins on EUV, that's obviously been a topic over time, and you've had that sort of improvement trend in the last few years. I think now you talk about exiting '21 with EUV gross margins being pretty similar to the group average. I wondered if you could talk a little bit to kind of what's driving that. And then on top of that, one would observe that on DUV, you're probably making, I think, mid to high sort of 50s gross margin there already, which is pretty impressive. And given your EUV position I guess the question is, could that ever theoretically approach those kind of gross margins over time? Is there any reason why that couldn't happen?

P. Wennink

executive
#24

Well, I think there's no reason why that could not have happened. And I think we've always said that is our target and our desire, and that will be our desire, to be on focus to actually get those margins to similar levels as deep UV. Now as we said for this year, we'll be looking at EUV margins that would be comparable to, let's say, the group average margins of last year. But this year, of course, the group average margin will go up because of the fact that we have an improvement of EUV. And if the upside that we talked about earlier on actually comes through, which will be deep UV, of course, there will be an upside to the gross margin profile for this year also. And just because we have more deep UV, which as you pointed out. Now it's -- the deep UV margins are pretty good at the immersion level, but they're somewhat lower at the KRF level where we have more competition because we have companies from Canon and from Micron, Canon particularly, which, of course, in a competitive area, the margins are a bit lower than the deep UV immersion margins. So if we have a lot of KRF demand, that could be -- that could dampen the growth a bit, but generally, you could say the more deep UV, the better, the -- and the impact it will have on the corporate damage.

Alexander Duval

analyst
#25

Very clear. I want to talk sort of relatively long term now and realize you can't disclose too much about the CMD and what scenarios might be there. But just sort of really high level and conceptually, it would be great to sort of get your views on sort of the very long term. And obviously, you've got high-NA, for example, which will be kicking in, I think, around 2025. So people used to talk about 2025 being a peak for ASML. And I'm just curious kind of conceptually how much longer you can keep growing beyond that? And what would be driving that presumably High-NA would be part of that story as well. But how should we think about the kind of drivers of growth? And how long you can keep on expanding that top line as well as your margins?

P. Wennink

executive
#26

Yes. You have to look at every wavelength, and I don't think EUV is any different. It has a life of about 12 to 15 years, and that is being replaced by a new wavelength or -- now we've just introduced HVM EUV in 2019. So it will bring us -- signal the way into the next decade. So it has a split, you could say, from 2019 to 2025, where we then see the transition into High-NA, about 5, 6 years for low-NA and they add another 6 years for High-NA, which will bring you in the 2030s. And it's always been the case. It has always been the case where we have about a 10-, 12-, 13-year vision of where our roadmap brings it. We're not any different. It's 2021. So I think this will also be the case. This -- actually, if you ask the question with the information we give our customers, do the customers have a roadmap that actually drives them beyond 2030? And they do in terms of the shrink. So -- and as long as we keep shrinking, we will grow. And because -- it's not only because of the roadmap, it's just the fact that we have these devices that every 2 to 3 years will create so much more value, and that will push the exponential growth of the compute power that is needed. And not only the compute power, but also the storage that is then needed and we will have the rollout of 5G and towards the end of the decade, 6G. It's just this big, massive pipe that is able to transport all that data that will have to be processed. And all the connected devices. I mean, if you think about -- so it's not only the leading edge. I mean, it's also very much the compute at the edge, whether it's your mobile phone, whether it's your PC, whether it's your car, whether -- it doesn't matter. I mean, when I -- 5 years ago, people said, 25 billion connected devices by 2020, turns out to be around 40. And now they think about 250 billion to 400 billion devices by 2030. That's a lot of compute power. There's a lot of chips that we need, a lot of semiconductor, yes? So I think this is -- and it's driven again by the ability of the industry to keep shrinking at affordable cost. And this is why the roadmaps of our customers kick in where they need INA and they need EUV and they need higher productivity, better CVU, better overlay throughout this decade and well into the next decade, we keep shrinking. And what comes next is what our research people are actually working on today. It's too early to give you a lot of details on it, but this is the -- what is it? And is it, again, having the wavelength? Or is it something else? This is what we've been working on for the last 35 years. I mean, innovating and making sure that we can follow what our customers are trying to do in terms of geometrical shrink. And when people talk about 1 or 2 nanometers, they're able to think it's the physical structure is 2 or 1 nanometer, which is not the case. I mean, a real physical structure is significantly larger. It's the -- you could say it's the marketing nomenclature that they use as the, let's say, the smallest difference between 2 physical structures, and that's how they also present it. So every customer does it in a different way, but we need to realize that what really physically printed is significantly larger. So this is why there's still a runway. There's a lot of runway left. So you will just see acceleration of productivity shrink, overlay, the CD uniforms that you show, the critical dimension uniformity, those will be the big drivers for at least the next 10, 15 years.

Alexander Duval

analyst
#27

That's very clear. And I guess just to finish up with a couple of long-term questions as well. Investors sometimes ask about new architectures, new stacking architectures, to what degree would that have any impact, positive or negative, I guess, on ASML? And then obviously, to deliver that long-term roadmap, High-NA is super important, so how confident are you in the roadmap there? And to what degree is that sort of within your hands to execute on that? And what could be the challenges there?

P. Wennink

executive
#28

Well, I think High-NA will happen. I think there's no doubt in my mind. The question you should ask is how will the development R&D roadmap of our customers develop so that when they introduce it in 2025, it's more a question of what's the capacity that is needed at that time to ramp the 2-nanometer nodes of our customers. How many wafers do we need to produce? I mean, the question we're currently having with our customers is more, how much do you need? And not so much whether High-NA will be there. High-NA will be there. I think that's not the issue. So it's more how much is needed in terms of wafer capacity at that time in the second half of this decade, which means investments for us and for ZEISS or the supply chain. I mean, it's a long lead time item. So if you think about the first introduction of High-NA, it includes the manufacturing at ASML, plus the installation time, 12 months. They have the production of the lens, 12 months, so it's 2 years. So if you work back from 2025 and in 2023, we'll meet that capacity more than the 8 units that we currently have. We need to build effective, which we need to start this year. So this is long lead time items. These are more the commercial and the industrial questions that need to be answered. How much? Not whether it will happen. Now on your question of stacking and architectures. You have to remember that geometrical shrink is only one of the scaling engines. Scaling happens at many of it's architecture, depends on what you're asking. It's materials. It's system integration. And anything that creates scaling value is good. The more scaling value there is, the better it is because we need them little. We need more wafers. Because if the value is there, we're all going to buy it in the end through our products. So we welcome any form of architectural advancements to create value. So it's always good. And logic scaling even [indiscernible] lethal, yes? So let's see. Keep it coming, I would say.

Alexander Duval

analyst
#29

Great. Well, Peter, on that positive note. Thank you so much for joining us. Really appreciate you answering all my questions. And thanks to everyone who dialed in and Peter will speak soon.

P. Wennink

executive
#30

Okay. Alex, thanks. It was a pleasure. Thank you.

Alexander Duval

analyst
#31

Many thanks. Bye.

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