Cadence Design Systems, Inc. (CDNS) Earnings Call Transcript & Summary
May 21, 2024
Earnings Call Speaker Segments
Harlan Sur
analystAll right. Good morning. Let's go ahead and get started. Welcome to the second day of J.P Morgan's 52nd Annual Technology Media and Communications Conference. My name is Harlan Sur, the Semiconductor & Semiconductor Capital Equipment Analyst here for the firm. Very pleased to have Anirudh Devgan, President and Chief Executive Officer of Cadence Design Systems here with us today. Cadence, leader in electronic design automation or chip design software and hardware solutions that help semiconductor companies bring their most advanced chip SoCs to the market, and Cadence is also a leader in the emerging area of Systems Design and Analysis Solutions. Now so Anirudh, thank you for joining us today. Before we get started, I am going to read on the team's safe harbor statement. Today's discussion may contain forward-looking statements, including Cadence's outlook on future business and operating results due to risks and uncertainties. Actual results may differ materially from those projected or implied in today's discussion. All forward-looking statements during this meeting are based on estimates and information available as of today and Cadence disclaim any obligation to update them. So with that, Anirudh, again, thank you for joining us today. Maybe to kick things off here and for those of you that may not know cadence that well, the team is an enabler and beneficiary of 3 major trends, right? First, you've got significant growth of leading-edge chip designs targeted at accelerated compute and AI; two, the move of semiconductor customers from developing chips to developing systems, right? And number three, the move of your systems OEMs and hyperscalers from developing systems to developing chips. And so maybe you can summarize how the portfolio of solutions at Cadence addresses all three of these trends?
Anirudh Devgan
executiveThank you, Harlan, and thank you, everyone, for your interest. So like Harlan mentioned, we are basically a software company, and what we like to say is computational software. So this is not your regular software. This is more mathematical numerical software. Because these chips are too complicated to be designed by hand and they haven't been for a long time. So they're mostly designed by Cadence. So what we say is almost any chip design in the world today uses some form of Cadence software, okay? And then the growth drivers, like Harlan mentioned, there are several of them. The three big ones are -- so right now, about 55% of our revenue is from what we would call semiconductor companies and 45% is from system companies. And semiconductor itself is in a big renaissance, as you know. So right now, the semiconductor revenue is roughly $500 billion or so going to -- is widely projected to be $1 trillion by end of the decade. And I think that may prove conservative. It might reach there before that. So there's a lot of growth in semiconductor design anyway. And I think the big drivers, as you know, about going from $500 billion to $1 trillion, there are at least two big drivers. So one is all this AI and data center demand and then the other is definitely automotive. We can talk about that. So those are multiple hundred billions each, right, growth drivers. And then all the other edge devices, consumer devices that may have. We're glad to participate in all that. So there's a massive growth in semiconductor content. A good example is like yesterday, this announcement by Qualcomm and Microsoft. And Cristiano was at our Cadence conference a few weeks ago. So we have a long history working with Qualcomm and all their advanced CPUs and also history working with Nuvia which Qualcomm acquired, which is the basis of this SnapDragon XElite. So it's really good to see that AI coming to the edge in disruption in that kind of market and in a lot of other kind of semiconductors. And of course, we have a long-term partnership with NVIDIA, we can talk about. And Janssen was also there at our CadenceLIVE conference a few weeks ago. So that's the semiconductor part of our business. And also, these companies like NVIDIA and Qualcomm are perfect example, they are not just semiconductor companies anymore. They are almost like system companies with massive software stack, firm ware stacks. The second big growth for our business the last few years, which is expected to continue, is system companies doing silicon, okay? And of course, it started a few years ago, almost 10 years ago by the big mobile companies doing it, and they kind of led the path of doing silicon and they're phenomenal in their own way. And then last few years is all the data center and automotive companies. So I think this is public -- it's fairly public, all public information that all these big data center companies, whether in the U.S. or outside like are all doing -- have massive silicon investments and same thing is true in globally, right? So that's a big part of [indiscernible] -- that's what is like what we would call the 45% and that's also growing well. And I still think that's in the early innings because there's still a lot of things to be done in AI and also automotive and other kind of mobile. So that's the second part of our growth, and we can talk more about that. And then the third part is we are expanding our TAM anyway. So as we work with these system companies and semi companies, our traditional suite is EDA and IP chip design software. But like even NVIDIA, they talk about not just designing the chip, designing the data center, or not just designing the phone, designing the mechanical part of it. So there is a convergence between electrical and mechanical design that is happening for a long time. And I think Cadence is the first one to recognize this in 2017, 2018. So we have a new category, what we call in sort of EDA SD&A, System Design and Analysis, and that's growing 20% plus last several years. And then even this year, we announced like partnership with NVIDIA to do data center design and then some other tools for car design, with McLaren and Honda. So that's also a good growth business for us. That's about a $10 billion TAM for us, and we are like $500 million, $600 million. So there's a lot of growth opportunity there. So those 3 would be the kind of systemic growth drivers, which should continue for the next 5, 10 years. And then coupled with that, we are always very disciplined financially. So we have very good financial performance, margin. We always focus on that EPS growth. But at the same time, we have the highest investment in R&D. So we have about 35% of revenue invested in R&D, but at the same time, have very high profitability.
Harlan Sur
analystNo, that's great. And we'll get into all aspects of that through our discussion here. I do want to start off with the core sort of chip design software EDA business, right? We do our best to track and chip design activity primarily with the large ASIC semiconductor companies, right, that are helping hyperscalers and systems companies, co-design their custom chips because we think that they're a good proxy for just overall sort of leading-edge chip design activity. And chip design starts have accelerated just over the past 18 months, right, given that there is this AI arms race amongst these cloud and hyperscale titans and off-the-shelf guys like in NVIDIA. They all want to bring their leading-edge silicon solutions to the market sooner rather than later. How has this acceleration in leading-edge design starts manifesting itself in terms of how you see the growth outlook for your business not just this year but over the next several years, right? Is it -- does it just provide you with confidence on to your low to mid-teens type revenue growth target? Or do you think about it as a TAM expansion opportunity that can buy us the growth towards the upper end of the growth range.
Anirudh Devgan
executiveThere's going to be a lot more Silicon design in the next few years, right, even like our foundry partners have commented on like how much more design activity, as you know, is that N3 or 3-nanometer versus 5 nanometer or 7 nanometer.
Harlan Sur
analystEarly 2-nanometer, right?
Anirudh Devgan
executiveExactly. So we are working on 2-nanometer for some time already. Several years already because some of the early customers are already designing at 2-nanometer and most of our R&D with like TSMC or the fabs like Samsung, Intel now switching to 1.4 nanometer. So one good thing is that we are at 3 so there is 2, 1.4 and 1. So there's at least 3 more nodes. So there is at least 8-10 of Moore's Law that we can see right now. And each node requires bigger and bigger chips because Moore's Law may have slowed down in performance becuase one question always is, okay, is there -- how much room is there to keep this semi conductor? But in my viewpoint, at least 10 years of pure scaling, okay? And whenever you have pure scaling, the performance may not improve as much as in the past. But the area scaling is there. So when you go from 3 to 2 nanometer, there is a massive area scaling. So that means more things can be put on the chip, right? And then all these chips have to be designed and they always need more software from Cadence, because the design effort is roughly proportional to at first or a proportion to chip size even though the chip complexity also goes up. So if you look at from now until 2030, and the way I look at it, right now, the chips are $100 billion to $200 billion. Blackwell is $200 million, but most of the other chips are $100 billion. And it's widely projected by 2030, there will be $1 trillion. To answer your original question. So that is at least chip size will go up by 10x in the last -- next 5, 6 years, but the chip complexity will go up more than that with the software. And also, it's not just the size they have more cores, more GPUs the complexity and verification of the chip goes up exponentially with size. So the chip complexity, the design may go up by 30x, 40x from now until the end of the decade. And it's not possible for our customers to hire like 30x, 40x more engineers. I mean they will hire more engineers but there's not even enough engineers graduating that can be hired 30x, 40x more. But I think they will still hire more. So let's say, there are 2x, 3x more engineers. So then there is a 10x productivity gap. That has to be made up by better software and better compute and using AI in our own tools. So I think the real opportunity for Cadence and the industry is that from now until the end of the decade, the more of the R&D can go to automation rather than what has done in the past. So even if you look at EDS spend now as a percentage of R&D has improved in the last 5, 10 years. But there is opportunity to do a lot more in the next -- and that should help in terms of our top line growth.
Harlan Sur
analystAnd that's a good point that you bring up, right? Because on one hand, your solutions help NVIDIA's and Google's and Broadcoms of the world bring their most sophisticated AI chips to the market. But then in return, you need the compute power and also integrating AI capabilities into your own set of solutions, right, in order to boost sort of productivity. And the team has been developing and integrating AI and machine learning-based methods across your entire portfolio, right? For digital implementation with Cerebrus verification with Verisium. And even into your system design and analysis portfolio. So talk about the use cases and adoption of your Cadence.AI solutions portfolio? And any metrics that you can share with us in terms of adoption curve?
Anirudh Devgan
executiveYes, absolutely. So first of all, one thing you have to be careful these days, everybody calls everything AI. That's another issue. But -- like I said, we have been doing this computational software for a very long time, right? The history of EDA is over the last 30, 40 years is this kind of mathematical software. So we have done all kinds of automation over the year. And AI is another way to -- it's another significant way to provide that automation. But even if you go back like 20 years ago, a chip would take -- I remember like these big chips at that time would take like 4, 5 years and 400,500 people, okay? And these days, you can do it by like 50x or 100x easier than that, both in terms of time and people. And I think the foundry ecosystem has played a role in it and our software has played a role. So it's much easier to design these chips than 20 years ago. That's why all these system companies are doing it now. but there is still more room to go. And I think the one thing that we never did before is if you go to our customers, they design -- they are running our software on a daily basis. But there -- we -- our software was mostly what I would call an -- all software was more [indiscernible] run that is you give it an input, and it runs for 1 or 2 days and gives you a very good output. But the design doesn't happen in a single run, right? Typically, what is happening in these -- all these big companies the designers, they run it, they change something, they run it again, they change something, they run it again, okay? This is what happens over 6 to 12 months to design one of these chips. So -- so we never provided automation in that, the workflow automation. Not that we didn't want to provide it, but there was no mathematical way to transfer the learning from one run to the next run. Okay. But now with AI, with real AI, okay, not -- a lot of times people would call simple automation -- AI, but what we would call real AI or GenAI or a real reinforcement learning, we can actually model the what the human is doing manually into an AI model, and we can automate the workflow. So that's how we applied these AI techs. And I can give a lot of examples. But what that does is it can shorten the time, design time, but more -- so that's a productivity improvement, which is well known from an AI standpoint. But I think what is more interesting to me is that it can give a better design. To give you an example, one of our customers is designing automotive CPU, and they are changing a lot of things. In that case, they were changing 17 different wearables. Some of them are design wearables, some of them are process variable. Some of them are power options. So you do the design, it takes you 6 to 12 months. But you're doing it by human intusion, right? I used to do this before, let me try this, try this. So even though our tool Innovus is very complicated, the driving of that tool is done manually. But with AI, we can do it mathematically. So it can give like 5%, 10%, 15% better PPA than a human design. It depends how good the original design was. But that's remarkable. So PPA stands for our Power Performance in Area. So we have like 8%, 10% better power, okay? That's like huge compared to -- when you go from 7% to 5% or 5% to 3%, you may be getting 10% to 15% PPA improvement with massive investment. -- and you're getting like roughly that or slightly less than that with better software. So there is a huge value in automation and also PPA improvement. So we are applying all kinds of AI techniques to improve this whole workflow from a single run to optimizing the surge of the design space.
Harlan Sur
analystIn terms of productivity gains, right, hardware verification, emulation, prototyping, this has been a big contributor to the team's double-digit growth profile here. you're essentially creating a digital twin of your chip design on a high-performance compute cluster, you're accelerating verification efforts and also getting a head start on the embedded software design that will eventually be running on these chips, right? 10 years ago, these hardware-based verification systems were sort of a nice to have, not necessary. But given the sheer size of current generation chip designs, the usage of hardware-based verification and emulation is now mandatory, right? You're also at the start of an upgrade cycle with your next-gen Palladium Z3, Protium X3 platforms with a strong near-term demand profile. But I think the investor question comes up after 3 strong years of hardware sales, will customers have enough hardware and compute emulation and prototyping performance capacity? Or does the team envision continued growth beyond this year, just driven by sort of the sheer increases in chip complexity and software development?
Anirudh Devgan
executiveYes, that's a good point. So I'm super excited about the new hardware. So I mean we are primarily a software company, but just people who don't know, we do sell some hardware products. and this is to help the design process. So what happens is if you want to -- NVIDIA is a great partner and a public supporter. So I can talk about NVIDIA. So -- good thing is like, like I say, Blackwell is announced, the chip comes back, but all the software is also available at the same time, okay? So this is a new change in the last few years now, NVIDIA has been doing it for a while, but now everybody else is in which hardware and software development is overlap. So in the past days, like 20 years ago, you would do hardware development and then you would do software development and then the chip would system would come out. But now it's overlapped. So hardware and software is developed in parallel. So when the chip comes out, 3 months later, you can buy it from Super Micro whoever your favorite vendor is and everything works, right? So the only reason that's possible is when you're writing software and all these system companies are writing software and semi companies, there is no chip. So we have a product called Palladium that will mimic as if the chip [indiscernible]. Okay. And it will mimic it like thousands of times faster than journal purpose hardware like CPU or something. So then it became like an essential part of the design process. It's almost impossible now to design any of these complex chips without having emulation on palladium. That's why, of course, Jensen was saying it's more important to him that a refrigerator or ...
Harlan Sur
analystI think when he came on stage, what was his first comment? "I love Palladium, I need more Palladium" right? Isn't that what you said to you?
Anirudh Devgan
executiveIt's great. NVIDIA is a great partner. I think he publicly said that design of Blackwell would not have been possible without Palladium. And this is true for all the other kind of chips as well and big chips. And so this is happening for a while already. Now what happens is as the chips get bigger and bigger and then you have more software running on them. The need to verify these things also goes up exponentially. So where we sell Palladium is, for example, and this is -- also was talked about. So GPUs have more logic than a CPU, like you have a CPU could be 100 billion transistors but a lot of it is memory. So in emulation, it may require less capacity. But GPU is always not only they are big, but they have more memory, okay? So Blackwell is about 200 billion transistors. It was emulated on 8 drags of Z2, which is our previous product okay. And now with Z3, which is our new product, we just announced in April, we can go to 16 racks on Z3. So that's about 5x bigger capacity than Z2. So we have our ability to now emulate chips with 1 trillion transistors, okay, which is huge. So that should be good for the industry for at least for the next several years, several generation. Even a partner like NVIDIA said they can use Z3 for several generations of next-generation GPUs and then the other industries. So it's just a big jump. Now the question is how -- what does the demand look like by these systems? Like -- so first of all, even with the transition year this year, I expect to have -- every year, we have had a record year, like you mentioned, in our hardware business. So at this point, I do expect '24 should be a record year also. Our guide is fairly we are not assuming a massive growth in the functional verification business, which hardware is part of, but it still should be record than last year. And of course, we are not guiding next year or year after because we are pretty conservative in those things. But historically, a new refresh should add to future growth. And then what happens in these things, so like I was telling earlier, what's going to happen for the next 10 years is there's going to be this Moore's law. There's 3, 2, 1.4 and 1, okay? And on top of that, there would be -- there's 3D-IC even Blackwell or even Intel's latest ship or Amazon, they're all multiple chiplets on [ diet ] on a package, right? So it's no longer limited by the radical size. Blackwell is like 2 full reticle. So the actual capacity of the system whether it's a single chip or multiple chip in a package is going to go up exponentially in the next 5, 6 years. Okay. It's just because of the Moore's Law scaling, you add 3D-IC to it. And it's all driven by the demand of more compute and whether it's in self-driving cars or data center AI. So the bigger the chip gets you need more emulation capacity because these things, when we sell Z2, Z3 is based on how many gates it can emulate. So if the number of gates is 10x bigger, you need much more ambulation capacity, not only for -- to fit the design, but also as the chip gets bigger, it has more verification to do, exponential more corner cases to. So the verification demand should go up, which translate to hardware demand and also our software demand. So I mean, we'll see how it goes. But fundamentally, there is a lot of reasons that this should continue for sometime.
Harlan Sur
analystLet's talk about advanced packaging, right. The adoption and acceleration of AI and accelerated compute has really driven a push towards things like high bandwidth memory, 2.5D, 3D packaging, right? All of the leading-edge chip companies are moving to these types of architectures. It's a way to, like you said, continue to drive Moore's Law like performance scaling without having to rely solely on semiconductor process technology skilling, right? Here, the Cadence team benefits with, for example, Allegro X and integrity platforms for design implementation of Advanced Packaging and PCB right? Celsius for the thermal analysis and our verification tools but advanced packaging also pulls a lot of critical IP like chip-to-chip connectivity portfolio and so on. So can you just update us on -- if we take all of that under the umbrella of Advanced Packaging Help us understand the revenue contribution momentum of your solutions targeting the advanced packaging segment of the market?
Anirudh Devgan
executive; Yes, Harlan. So this is actually one of the reasons that we did this whole -- like I was talking about in 2017, 2018, we moved to system design and analysis. And the reason was -- there are a couple of reasons. One is that we are, of course -- we have a pleasure of working with all the leading companies in the world. So we do know what is happening. So on the chip side. But at the same time, Allegro is a long-term Cadence product like almost 30 years and is the most advanced tool used for packaging. So in Advanced Packaging that's the most common tool used. And even in the '90s, there was all talk of interposer and all that, even when I was in IBM, we used to talk about it. And then when I joined Cadence almost 10 years ago, we worked with TSMC on a 3D-IC flow okay? But it did not go as well 10 year or 8 years -- whatever but last few years it's a resurgent of because technically the industry has always known the way to -- one other way to solve scaling not just system on a chip, but system chips in a package gives you scaling just like Blackwell. Even though each chipled is huge, you can have 2 of them and then a bunch of HBM, right? So it gives an orthogonal dimension to more slow like you see -- and it's -- and now look at TSMC, they are investing a lot in Samsung, Intel, GLOBALFOUNDRIES and all the memory players. So Cadence has a unique position because we are the leading packaging -- advanced packaging actually the format that is used to manufacture advanced packaging is Gerber format, which is the Allegro format. So I always know for a while that we need three big things to solve this problem. So at the lowest level, like 3-layer stacks, the lower stack is, of course, chip design tools. We are the only company that has both analog and digital chip design tools. So this is Virtuoso for analog and Innovus for digital. Because some of the chiplets are purely digital, some are analog, they're mixed signal, that's the whole. And then the second layer of that stack is we need package design tool, which Allegro and Allegro X is the main platform in the industry. And then the third layer on top is you need analysis tools like thermal analysis, stress analysis, even like stress mechanical stresses, because HBM has 8 layers of memory going to 12 layers of memory. There's all kinds of mechanical stress that happens. And thermal, TSMC and other foundries have talked about thermal being a big issue. So that's why in 2018, we launched all these analysis tools, SD&A and all that. And if you put it all together, that's what we call the integrity platform. which is probably the most complete and successful platform for 3D-ICs. And when TSMC launched in October of '22, this latest round of 3D-IC, which is very, very successful now. We have a big partnership with TSMC on 3D block and then also now with Samsung, with Intel, GLOBALFOUNDRIES and all the. So this is going to be a big thing. I mean, we can talk a lot about it because there are a lot of benefits to this, even like take an example like some of these hyperscalers like this is all well known, like Amazon launched Amazon few years ago. It has like 607 chiplets on a package. So it started with HPC, high-performance computing, which is the AI or even CPU compute, Graviton was a CPU chip and then there is the AI chip. But I think this aggregation is moving throughout the industry stack. So Intel launched [indiscernible], which is laptop chips, that's disaggregated. And then it's happening in auto is happening in other markets. So I think this is going to be a big wave and Cadence is very, very well positioned in this area. I mean some of it is good planning. Some of it is we had Allegro for a while. Some of it is working with the latest foundries. So -- but this is going to be a big thing along with the regular Moore's Law scaling.
Harlan Sur
analystYou talked earlier about the mix of your customer base, right? 55% is classical semiconductor companies, 45% is systems, hyperscalers and so on, right? And again, like we've seen so much more announcements. Obviously, we're familiar with NVIDIA, Hopper, Blackwell, AMD, MI 300. But in fact, we've actually seen more product announcements from the cloud and hyperscalers that are doing their own custom, what we call ASIC designs, right, Google TPU. Amazon, as you mentioned, Graviton Inferentia, Tanium, Meta, MTIA, ASIC programs and so on, right? So it seems like the hyperscalers large OEMs continue to be gravitating more and more towards wanting to do their own custom solutions. So can you just give us an update on your systems and hyperscale customers, right? Are you seeing the design activity accelerating within this customer base? And does the contribution mix from these customers actually see rising over time to maybe 45% to 50%, maybe even half of your business?
Anirudh Devgan
executiveYes. I think the question always is like, okay, our system companies doing silicon is this going to continue? Or is it going to accelerate? Is it going to slow down? I mean, this is always a question. Because -- is it too hard? Or is it it's too easy? There's always the -- so what I would like to say is that what I found over the last several years of why do system companies do silicon, okay? And this -- this mobile company is a perfect example or like Tesla is a perfect example. So I found 3 reasons they do it. So first reason is it's a domain-specific product. So it can do some things better than a regular standard product cannot do. Like in case of Tesla, I mean, the power consumption was lower and Tesla has their own chip for FSD, right? Or when these M-Series chips came out for laptop is quite remarkable, right? Your laptop battery was the whole day and the laptops were so thin. That's why you're seeing now Microsoft and Qualcomm kind of follow what was started by these M-Series laptops. So there's always some unique domain-specific differentiation that happens. So that's one reason. Second reason is to control the schedule and the supply chain. Because if you're a huge system company, you're going to launch a certain amount of products or you have some schedule, you want some control over that. So that's the second reason. And the third reason, which is often, I think, not fully understood or not as talked about, is that if there is enough volume because this is -- you have to put the effort to design these chips. But the -- if there is enough volume, it is actually can be cost beneficial for the system company to do it. Because -- and what is that volume, it depends on each application, how much it costs. But definitely, in AI, there is volume and volume is growing. In mobile phones, there is enough volume, volume and laptop, there is enough volume. In cars, also there is enough volume. So I think the -- so for those three reasons, I think this is going to continue. Now there will be some -- not every system company will do it, but right now, not -- AI, it's happening more and more are doing it. But automotive, there's still more can happen. And then also what happens typically, and you can look at the history in mobile, typically, the company will do one or two chips first, make sure it's successful, then they expand to more and more chips. And you're seeing that with even in hyperscalers like Google did like a TPU than they do like a YouTube chip -- essentially is quite remarkable YouTube loads much faster. And then same thing happened, like you mentioned in Amazon. And then also, they will, in the beginning, do some part of the chip and then they will do the whole chip like in the beginning, they may use like an ASIC partner and then they may try to do more in-house. So there are a lot of trends that are in that direction. And then the question always is, okay, what is the going to be the distribution between like standard products versus in-house products, okay? And it's very difficult to predict. There will be some mix. And I think that's more -- from a Cadence standpoint...
Harlan Sur
analystYou went either way.
Anirudh Devgan
executiveThey have to be designed, right? So as long as there is financial reason, of course, for semi customers to do it, they should. And for the hyperscalers and the system companies and the mobile companies to do it, which they will. So we are glad to support both of them. Now what will be the actual distribution of what percentage? I mean, that's -- we leave that for the customer to decide in the market to decide. But our job is to support both fully, and we are glad to do that. Now whether system will become a bigger portion. So it moves very slowly because the semi is going to do so well anyway. Look at Qualcomm, NVIDIA, all these Broadcom, I don't know whether you call them Semis. So I think normally, the good thing for us is that both sides are growing. The Semi is growing and the system is good.
Harlan Sur
analystWell, just about out of time, but I do want to ask a question on the systems design and analysis. This has been a strong outperformer from a growth perspective, right, up 22% last year, outgrowing the overall market. It's set up to grow faster than your corporate growth rate this year. as you mentioned, right, the Cadence team was actually the first amongst your competitors 6 years ago to acknowledge this trend towards more subsystems and systems level design, even by your semiconductor customers. Since then, you've been building scale, a portfolio organically and inorganically, like it's going to drive $550 million, $600 million in revenues this year. with your EDA competitors setting up to potentially acquire ANSYS, how has the Cadence team going to step up to its efforts to build, scale, drive growth and maximize the synergies between your chip design and system design and analysis segments?
Anirudh Devgan
executiveYes, we are very well positioned. I mean, I think the other people are trying to react to what we did like 6 years ago. So there's no need to react to the reaction. So we are very well positioned in the sense that we are competing well with them individually. So if they combine together, I mean, I don't think that changes the competitive landscape in any big way. And also still -- like I was talking about in 3D IC, analysis is important, chip design is important but the packaging is super important. So we are still pretty differentiated in terms of analysis, still very differentiated because we have the broadest EDF portfolio with analog and digital. And then, of course, we have a critical piece of packaging that drives 3D-IC. So I feel pretty good in terms of our competitive position and the customer response has been very good. the investor response has been very good. Also, we have a good financial model, which is not in any -- which should continue next several years. There is no kind of overhang of a large acquisition and things like that. So See, we are more focused on organic innovation. And we look at M&A from time to time. to make sure our product portfolio is complete. But in SD&A, it's complete. I think one piece that was missing was structural analysis, which we just acquired BETA CAE.
Harlan Sur
analystThat's right.
Anirudh Devgan
executiveSo I feel pretty good about the portfolio and go from there. And also, I think what is different, okay, just 1 thing I want to comment is what's different in 2018 to 2024, okay? I'm as excited about the SD&A as I was before, but what is different is the importance of EDA, our core business is much higher now than in 2018. So we want to make sure as we expand into SDA, which we -- of course, I launched all this 6,7 years ago but now the core business is more important because of AI and all the semiconductor is much more critical now than 2018. So we want to make sure the R&D investment is well balanced, and we focus on our core because without core, there is nothing. So -- so that's why I'm more excited about the core investment in AI, expects the Z3, X3 Palladium. Also, we are doing more investing IP, IP should grow very well so comparatively we are very well positioned financially. I think we're very well positioned, and we have a lot of support of like the big, what we call household customers. So we always talk about team, technology and customers focus on that. So I feel good about where Cadence is. And I think if you go back from 2018 to now, we are better positioned than we were 6 years ago, even when we were the first one to start all this year.
Harlan Sur
analystWell, Anirudh great insights. Thank you for your participation today. Really appreciate it.
Anirudh Devgan
executiveYes. Thank you. Thanks a lot.
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full-text search, and the recently-added /api/v1/transcripts/recent polling endpoint for ETL pipelines.