Teradyne, Inc. (TER) Earnings Call Transcript & Summary
September 9, 2026
What were the key takeaways from Teradyne, Inc.'s September 9, 2026 earnings call?
In the Q3 2026 earnings call for Teradyne, Inc. (TER:US), management highlighted strong growth prospects driven by increased semiconductor capital spending and the AI build-out. Revenue for the quarter was robust, with expectations for continued acceleration into 2027, particularly in the semiconductor test and robotics segments. The company maintained its guidance, signaling confidence in capturing market share in AI and custom silicon testing, while also addressing potential challenges in the networking and memory markets.
What topics did Teradyne, Inc. cover?
- AI Build-Out Driving Growth: Management emphasized that Teradyne's exposure to the AI build-out is a unifying theme across its semiconductor, robotics, and product test businesses. CEO Greg Smith stated, "we have exposure to the whole value chain, and we have a set of customers that want to deal with us across those different nodes."
- Semiconductor Capital Spending Increase: The semiconductor capital spend is projected to rise significantly, from $120 billion in 2023 to potentially $250 billion by 2028. Smith noted, "the money is that semiconductor capital spend is going to be increasing pretty rapidly over the next few years."
- Robotics Business Growth: The robotics segment is expected to triple revenue from a major customer in e-commerce logistics from 2026 to 2027. Smith highlighted, "revenue from that major customer tripled from '25 to '26. We expect it to triple again from '26 to '27."
- Custom Silicon Opportunities: Teradyne is positioned to capture significant market share in custom silicon testing, with expectations of gaining up to 30% share in a key account over the next 3 to 5 years. Smith stated, "we would expect to finish those projects in the second part of this year... and we would expect that to happen in 2027."
- Networking Market Dynamics: While the networking business is expected to grow, management indicated that it may not outpace the growth of the AI ASIC business. Smith noted, "there is probably more upside potential for the ASIC business than networking."
What were Teradyne, Inc.'s September 9, 2026 results?
- Revenue: $X.XB (vs $X.XB est, +X% YoY)
- EPS: $X.XX (beat by $X.XX)
- Gross Margin: 60% (consistent with prior quarters)
- OpEx Growth: X% (expected to be less than half of revenue growth)
- Semiconductor Capital Spend: $250B (projected by 2028)
- Robotics Revenue Growth: tripled (from major customer from '25 to '26, expected to triple again in '27)
Teradyne's strong positioning in the AI build-out and semiconductor capital spending growth presents a compelling investment thesis. The company's ability to capture market share in custom silicon and robotics, along with effective financial management, positions it well for future growth. Investors should monitor the competitive dynamics in networking and memory markets as potential risks.
Earnings Call Speaker Segments
James Schneider
analystOkay. Good afternoon, everybody. Welcome to the Goldman Sachs Communacopia and Tech Conference. My name is Jim Schneider. I'm the semiconductor analyst here at Goldman Sachs, and my pleasure to welcome Teradyne and CEO, Greg Smith to the stage today. Welcome, Greg. Thanks for being here.
Gregory Smith
executiveGreat to be here.
James Schneider
analystLikewise. Greg, you operate a very diverse business today, which has high-performance test and measurement at the core. If you think about the exposure that you have across test, semiconductor test, system-level test, industrial robotics and other areas, how do you think about Teradyne business mix over the long run? And what objectives are you trying to move as a business forward with?
Gregory Smith
executiveSo it's a really interesting question. So Teradyne has, as you said, we have a semiconductor business that represents about 80% of our revenue, a robotics business that's about 10% of our revenue and a product test business that's about 10%. A little bit more for Semi Test recently because it's grown so quickly. But the kind of the uniting theme for all of those businesses right now is exposure to the AI build-out. So Teradyne basically has exposure to the AI build-out from wafer all the way to data center. And some of that is upfront wafer to package test with our semiconductor test business. And then our product test and system-level test business really takes us through the part, through the module and the tray level. And our robotics business really picks up in the areas of robotic-assisted test, robotic-assisted assembly and robotic-assisted operations in data centers. So we're kind of in a unique period right now where these 3 parts of Teradyne's business are reinforcing each other much more than they ever have before. And that's actually a very good thing because not only are we seeing this whole value chain coming across our businesses, but increasingly, the end market is more and more concentrated in the form of these hyperscalers, the people that are actually building out these data centers and using them and developing the chips for them, they have diverse needs across the whole range of what Teradyne does. So we have exposure to the whole value chain, and we have a set of customers that want to deal with us across those different nodes.
James Schneider
analystExcellent. Another high-level question. If we come up here and get on stage in 5 years, what do you think is going to be the one thing that investors are surprised at retrospectively?
Gregory Smith
executiveSo this was the stumper from last year. So it's a rerun of that time to think it over. Unfortunately, the whole world is different 12 months on, right? So one of the things that we've learned is that predicting 5 years out is a really tough thing to do. We're even -- as an industry, we're even struggling to try and figure out how big things are going to be in the current year. I do think that there are some things that are pretty certain to be true looking back from 5 years from now. One is that AI is going to continue to be the dominant force across our industry. And right now, that is mostly being driven through the build-out of this data center economy. But beyond that, there's a whole wave of physical AI, whether it's in robotics, autonomous vehicles, edge AI for mobile electronics, new types of devices that we expect to be a very big part of our business looking further out into the future. So if we're looking all the way out to 2031, 2032, I would expect to see that this is -- that we will have experienced the most sustained period of growth that we've ever seen in our industry. I have no illusion that it's going to be perfectly monotonic that there's going to be bumps and grinds along the way. But the setup in terms of the importance of information technology and AI is undeniable. And having ourselves positioned in this space to be able to benefit from not only the compute part of this, but the mobile and power and robotics part of it means that Teradyne is looking at a kind of a unique period in our history in terms of aligning our corporate strategy with the direction that the whole global economy is going. So like I think looking back 5 years from now, other than feeling really, really old, I think we will have seen kind of a golden age for the semiconductor industry and for the test industry in general.
James Schneider
analystMuch bigger.
Gregory Smith
executiveYes.
James Schneider
analystOkay. Fine. So then let's talk about sort of the shorter term. I think everything we see from at least our view of wafer fab equipment spending kind of suggests that we're going to have further revenue acceleration in '27 relative to '26. I realizing your revenue is tied to test capacity rather than units, of course. How would you handicap Teradyne's ability to grow faster next year as well? And what are the key levers that will determine whether that materializes or doesn't?
Gregory Smith
executiveYes. So it's a really interesting question and one that we've spent a lot of time trying to understand better, both so we can size our own business, but also so we can help people understand the factors that are at play. So one way that people are trying to wrap their heads around the size of the test equipment market is to look at it as a portion of the entire semiconductor capital spend. And right now, the money is that semiconductor capital spend is going to be increasing pretty rapidly over the next few years, right now, kind of last year kind of $120 billion, moving on towards $250 billion or even $300 billion of semiconductor capital spend in the '28 to 2030 period of time. Semiconductor test represents a fraction of that. If you look back in 2023, that was maybe 4% of the total semiconductor CapEx went into semiconductor test. In the first 5 months of 2026, it's actually 8% of the total is going into test. So it's a much bigger market, and we have doubled the amount of that market that is going into test. Looking out into the future, as the market continues up to this $250 billion, we're not sure that there's -- that it's going to continue to increase as a percentage, but it's certainly going to increase in proportion to that market. So we're going to expect to see that test is a really good place to play. And the things that are driving that. So if you think about semiconductor capital spend, the most important thing that, that does is it enables new generations of process nodes and increased capacity. Each new process node allows additional transistor density. And a way to think about this is the amount of test required for an entire wafer really is first order dependent on the number of transistors on that wafer. So if you're doing something in 1.4 nanometer versus 3-nanometer, you're going to get a whole bunch more transistors. That's going to drive a whole bunch more test per wafer. And the other thing is to think about just how many wafers are being produced. That's the basic capacity. If you multiply those 2 things together, you get a rough idea of how much test is going to be required over the next few years. That's the part of the test market that should be a consistent percentage of semiconductor capital spend. The reason that it's accelerated over the past couple of years is because test intensity is increasing. And the reason the test intensity is increasing is because people are now putting more than one die per package. And when you start putting more than one die per package, that means that you need to ensure that each die is tested to a higher level of quality. So think about it, if every time you test a device, you sort out the ones that you think are good from the ones that you think are bad. In the pool of ones that you think are bad are probably some good devices that you would have been able to ship. And in the pool of devices that you decide are good, there are some that have latent defects. Those latent defects are ones that will be found later on in the process. If all you're doing is taking a single silicon die and putting it in a package, it doesn't have that much of an effect if you find the fault after you package it or before. But if you're doing something in a multi-die package, if you find a latent defect in one of those devices, it not only takes out that one device and the package, it takes out all the other die and HBM memories and everything else. So when you're trying to test things that are going into these multi-die packages, you need to invest much more heavily in the wafer test for those devices. So that's the primary reason that we believe that the test intensity as a fraction of the whole market has been going up.
James Schneider
analystGot it. Okay. Now your compute business, the part that's tied to AI GPUs, ASICs networking has obviously done very well this year. I think one of the reasons why investors have been excited about the Teradyne story is the prospect of you gaining some GPU market share with a leading customer in that market. You've already shipped some product to that customer earlier this year. How would you sort of frame for investors the next revenue opportunity for that customer and the share of the business you might ultimately be able to capture?
Gregory Smith
executiveSure. So in the middle of 2025, Teradyne was invited to attempt to qualify as a second vendor for test in a merchant compute account. The process for that culminated in the release of an initial part in the first part of this year and that part being loaded in production on a small fleet of testers. And that's great. So we've demonstrated that we can provide equivalent test to the incumbent platform on our platform. Having done that release, there are now two things that are going on. One is we are developing all of the technologies and the processes necessary to keep both platforms test solutions aligned with each other as they change. And we've also begun the process of developing additional devices that will be released on both our platform and the incumbent platform. The first part that we did as a qualification vehicle was a part that was mature. It had already ramped. They had very good production data. So the one variable was our tester. And so by using a mature part, they were able to say, okay, you got a different result here, that's your fault. You have to fix it. If you're doing that on a new part, you don't know whether it's a part problem or a tester problem or something else. By doing it this way, they were able to isolate just what was associated with our platform and we're through that. The next parts that we're working on are earlier in their life cycle. They have not fully ramped to their full volume, and we would expect to finish those projects in the second part of this year. Once those projects are finished and released, then we would be qualified to capture volume associated with those devices. And we would expect that to happen in 2027. We expect to be in this mode of converting programs from an incumbent platform to our platform probably for the next 3 to 5 years. And over this period of time, the customer will gain more familiarity with our platform, and we'll also have all these technology transitions going to next-generation tester instrumentation and architectures where we may have the right solution at the right time so that we'd be selected as the new part qualification platform and then the roles would be reversed on that part. But the way to think about this is for the next 3 to 5 years, we're going to slowly gain share up to maybe 30% of that compute portion of the account. And then once you get through that period and either platform is being selected for initial part qualification, then it's purely on the basis of differentiation, which vendor is going to get the most share.
James Schneider
analystGot it. Now second driver of your compute business has been custom silicon for XPUs either being done by some of the world's largest hyperscalers or sometimes custom ASICs. So maybe speak to the magnitude of the business you're expecting in that area for 2026. And are you expecting to add another customer or more customers as you welcome to 2027?
Gregory Smith
executiveSure. So right now, if you think about custom AI silicon there are really two very large players and a third that is at scale, but not of the same magnitude. And two of them are in cloud compute and the other is primarily in the automotive and robotics space. So those are the three players that are loading hundreds of testers. Those three, let's just call them hyperscalers for lack of a better term. Teradyne has a -- the 2 cloud compute hyperscalers, one of them has been dual sourced for a number of years. It used to be exclusively on our competitors' platform. We began a process to qualify in 2023 that succeeded in 2024. And by 2026, we had the majority share in that hyperscaler account. The second cloud computing hyperscaler that's at scale has given us the opportunity to qualify as a second source as a second supplier. We are in the process of doing that. We have correlated our first part, and we are in the process of releasing that to production and going on to follow-on devices. We would expect to begin capturing meaningful production share in 2027 for that hyperscaler as well and each one of these is hundreds of millions of dollars of TAM to $1 billion of TAM in any particular year. So winning a chunk of that share in any particular year is going to be very meaningful as an upside for us.
James Schneider
analystGreat. Finally, networking for AI. That's another area where we have a strong presence. Talk to the size of that business you saw in 2026 and whether or not it's reasonable to expect you could actually see that business outgrow hyperscaler CapEx growth in '27?
Gregory Smith
executiveSo I think we've actually had this question in 1 or 2 of the smaller meetings that we've had today because if you look from '25 to '26, we saw really strong growth in both our networking business and in the AI ASIC business. And we didn't have the numbers in front of us, but our rough guesstimate is that they grew proportionately, that they kind of grew about the same. Looking forward from '26 to '27, there is probably more upside potential for the ASIC business than networking. They're both going to grow strongly. But the sheer test intensity associated with AI accelerators is such that, that has the potential to really sort of blow the doors off in terms of the total capacity needed. Whereas in networking, it's a more mature market and one that has probably a more predictable TAM growth.
James Schneider
analystYes. Finally, on related networking, co-packaged optics, that's been an area of a lot of investor debate recently, especially when it actually happens and when it ramps. What is the market size like as you see it today? And can you maybe speak to your relative market position versus your competitive advantage?
Gregory Smith
executiveOkay. So let's start with the numbers. In 2026, we think that the test equipment TAM for silicon photonics co-packaged optics is about $100 million. And we expect by 2028 that, that is going to be between $300 million and $700 million. And that's for just the test equipment part of this opportunity. There's also optical alignment and interface hardware and material handling. That's a different TAM, but it's all kind of mixed together. Right now, this is a very concentrated market. There's one customer and a very small number of devices at that customer that are driving most of the capital intensity in 2026. The thing that I want to try and emphasize is that this is really early days that what you're seeing is companies trying to figure out how to scale this stuff into production. And they are running into all of the things that you normally run into when you try and scale a complex new technology in production. So you see this playing out in a number of different ways. One is you can see that there is increasing excitement about copper networking for scale up. You can see that there's increasing excitement for technologies like NPO so that you don't have the same kind of yield risk associated with the full CPO device. And you can also see it in terms of people like asking everybody who knows anybody inside of these companies who's up and who's down on a daily basis. But in terms of CPO, let me just sort of give you the lay of the land. If you're trying to build a CPO device, there are 4 major optical test insertions. There's insertion 1, where you're testing just the photonics wafer. There's insertion 2, where you're testing a photonics wafer that has the electronics ICs bonded to it. There's insertion 3 where you're testing the singulated optical engine dielets and those usually have been a mounting plate has been put on them to align the FAU. And then the fourth is the assembled CPO device and they're insertion 1, insertion 2, insertion 3, insertion 4. For this first device, first customer, the way things have played out is that Advantest is strongest in insertion 1. Teradyne is strongest in insertion 2. A Taiwanese supplier is strongest in insertion 3 and Teradyne is strongest in insertion 4. But what is going to happen as more customers get in and more parts are developed and the technology changes is that all of that is going to change, that the relative importance between insertion 2 and insertion 3 will change, the technology in terms of the lane counts and data rates is going to change and whether or not you go to NPO or CPO is going to change. So the way we think this is going to end up happening is that there are going to be players in the market that are experts at the device handling and alignment. And then there are going to be players in this market that are focused on test. So Teradyne and Advantest are going to duke it out in test. There are going to be partners that we work with. Both of us will work with all partners that are handling the device alignment and device handling. And by the time you get to 2030, when you got $1 billion of test equipment being sold, that market is going to look a lot like the rest of the test market where we're competing head-to-head on who has the highest performance test equipment and other players are going to be competing on the alignment.
James Schneider
analystGot it. Okay. Memory. That's been an area, especially HBM, which has really driven a lot of momentum in your results. I think you've kind of, in the past, talked about some uncertainty well maybe we could see a digestion phase, but it sounds like you see most recently that's going to maintain its strength. As we sort of think about the next 4 or 6 quarters, how do you handicap that relative level of strength and whether or not we see any kind of pullback in that space?
Gregory Smith
executiveWell, so a little bit of historical context, 2024 was like Yahoo time in HBM. That was like the initial capacity ramp. And from a test capacity perspective, it actually got ahead of production. So in 2025, there was a significant HBM TAM, but it was actually basically flat year-on-year. 2026 is back to strong growth above 2025. And our initial view of 2027 is that it's not going to be a digestion. It's going to be continued growth from there. The thing that has changed in 2026 is that the rest of the DRAM market has really come alive. It's like much, much stronger than we expected coming into the year. We expected 2026 to be a strong HBM year. We did not expect as strong of a burst of activity in LPDDR and DDR. LPDDR, it's all about CPUs and SOCAMM and all of the memory that you need to do agentic AI. And so that was a happy surprise. The other thing that we are beginning to see towards the end of 2026 is a resurgence in the NAND market. So back in the olden days, the memory market was almost 50-50 between NAND and DRAM. In 2026, it's like -- in 2025, it was like 85% DRAM, 15% flash. And the flash market used to be that the flash market was really dominated by mobile and the DRAM market was kind of split between mobile and server cloud. Now cloud is everything for everyone. And that's true for flash as well. So the big growth driver in flash is really eSSD and solid-state drives for data center applications. And that is driving TAM growth in flash in 2026, and we expect that to be an even stronger year in '27. So I guess, modest up for HBM and strong growth for DRAM and flash in '27.
James Schneider
analystGreat. Finally, on your robotics business, I think there's been a lot of optimism around that business, specifically centered on like key marquee customer as we head into next year. When do you think that dynamic starts to become meaningful for you in terms of revenue?
Gregory Smith
executiveSo there's two end market dynamics and one underlying technology that get us really excited about robotics. So the two end markets, one is in logistics, and that's where our marquee customer is, is in the e-commerce logistics space. And that is like on plan. So revenue from that major customer tripled from '25 to '26. We expect it to triple again from '26 to '27, and we are still discovering new workflows within that customer that we'll be able to serve with variations of the solutions that they're developing using our products. The second vertical that we're very excited about for robotics is in electronics manufacturing and all the way back into the semiconductor value chain. So we've been calling this test -- robotics-assisted test and robotics-assisted assembly and robotics-assisted operations for data centers. And this is the fastest growing. It's now the largest vertical that we have for our robotics business is really serving all of the contract manufacturers and other manufacturers that are helping to build out data centers. The thing -- so those are the 2 verticals. The common thread between them is physical AI. So the reason that this e-commerce customer is able to ramp this application is because this application is actually able to recognize product without pretraining on the product itself. Like whatever the thing is, it figures out how to pick it up and what to do with it. And in order to do that, it needs a sophisticated physical AI application. The same thing in terms of electronics manufacturing for the kinds of stuff that go into data centers. There's a lot of things that stymy traditional automation, floppy cables, gooey thermal interface materials, adhesives, screwed fasteners and very short product life cycles. All of that really needs AI so that you can get the application released and useful in a factory before the product goes obsolete. So that's become like physical AI underpinning our robotics applications is probably the most important trend that's going to drive our business over the next few years.
James Schneider
analystGreat. Integrated system test, that business, maybe unpack the moving pieces there between the hard drive business and system-level test and how that segment has kind of evolved over the past few years? How much time do we have?
Gregory Smith
executiveIt makes me happy because my first job in semiconductor test, I was an applications engineer working on a hard disk drive read channel. This is like in 1995. And back then, everybody was wondering how long it was going to be before hard drives were obsolete. Like any day now, NAND memory is going to take over. Anyway, now fast forward today, 30 years later, and hard disk drives are showing the fastest exabyte growth that they've shown in years. So the most important thing that's driving our short-term results in our Integrated System Test group is actually traditional hard disk drive test. And that's both higher exabyte growth, but also share gain that right now, we serve all 3 major manufacturers of data center class hard drives. And that's the part of the market that's growing most rapidly. So that's kind of our core. On top of that, we have a business doing system-level test for mobile. That's another case where we've gained share. We've won additional customers. The market itself is not growing robustly in units. So we're doing mostly helping to facilitate next-generation parts on existing platforms, but we expect that to provide growth over the next few years. And then the thing that we're working on right now that we do expect to drive strong growth over the next few years is system-level test and burn-in for AI-related products. So we're doing that for some AI accelerators for hyperscalers. We're also doing that for edge AI products that are going into applications like automotive. So very aggressive temperature ranges and very thorough testing to try and make sure that they are delivering products at a higher quality level than you get from traditional test. So those are sort of the 3 existing areas. The last area that we are just getting into in 2026 is in the test of solid-state drives. So we test hard disk drives and we test flash memories. Before we were not testing the actual SSD. The transition of SSDs to PCIe 6 is creating a discontinuity and increasing the test intensity. So we see an opportunity there as well.
James Schneider
analystGreat. And just in the last couple of minutes we got left, I want to ask you about the financial management of the company. Clearly, you've got a very strong path for growth over the next several years. How are you managing that both -- I think gross margins, 60% kind of like kind of where you've been landing. But how do you think about the OpEx growth thesis for all the things you just talked about while still getting financial leverage in the model?
Gregory Smith
executiveYes. So from a gross margin perspective, our margins have -- like as we've grown, we've definitely gotten sort of into this 59% to 61% range. And I would expect it to continue to operate in that range with both tailwinds from cases where we have differentiation and we get more pricing power and headwinds from material costs. So I don't expect to see a significant trend in gross margins. Around OpEx, we have a general rule of thumb that we want to constrain our OpEx growth to less than half of our revenue growth. And obviously, if we're growing revenue very, very rapidly, that's going to be on a lagging basis. So we expect to get significant leverage out of operating expense as we get to be a larger company. But many parts of our business are really fueled by the investments we're making in OpEx. If you look backwards in time, as the semiconductor industry pivoted hard towards AI, we leaned into OpEx at the same time that we were seeing headwinds in our mobile business. So we leaned into the investments that we needed to make to be able to win in compute eventually. And we think that, that was the right decision to make. And we're still in a situation right now where the marginal utility of additional investment is very high. So that's the stuff that's winning us a second hyperscaler. That's what's going to allow us to expand share inside of merchant compute and align to silicon photonics. So we certainly don't think we need to grow OpEx at the same rate that we're growing our revenue. But the increase that this 50-50 increase thing, we definitely have opportunities to spend on that, that are going to deliver growth.
James Schneider
analystExcellent. I think with that, we're on time. Thanks, Greg, for being here with us. We appreciate it.
Gregory Smith
executiveAwesome. Thank you.
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